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Semiconductor manufacturing process
"1 nm process" represents the next significant milestone in MOSFET (metal–oxide–semiconductor field-effect transistor) scaling, succeeding the "2 nm"
1_nm_process
Semiconductor manufacturing process
manufacturing, the 2 nm process is the MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node. The term "2 nanometer"
2_nm_process
Semiconductor manufacturing process
In semiconductor manufacturing, the "3 nm process" is the next die shrink after the "5 nm" MOSFET (metal–oxide–semiconductor field-effect transistor) technology
3_nm_process
MOSFET technology node
In semiconductor manufacturing, the "7 nm" process is a term for the MOSFET technology node following the "10 nm" node, defined by the International Roadmap
7_nm_process
Semiconductor lithography method
The "28 nm" lithography process is a half-node semiconductor manufacturing process based on a die shrink of the "32 nm" lithography process. It appeared
28_nm_process
Semiconductor manufacturing processes
defines the "5 nm" process as the MOSFET technology node following the "7 nm" node. In 2020, Samsung and TSMC entered volume production of "5 nm" chips, manufactured
5_nm_process
Advanced lithographic node used in volume CMOS semiconductor fabrication
25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm. For comparison, cellular ribosomes are about 20 nm end-to-end
65_nm_process
MOSFET technology node
defines the "10 nanometer process" as the MOSFET technology node following the "14 nm" node. Since at least 1997, "process nodes" have been named purely
10_nm_process
MOSFET technology node
nanometer process refers to a marketing term for the MOSFET technology node that is the successor to the 22 nm (or 20 nm) node. The 14 nm was so named
14_nm_process
Semiconductor device fabrication technology node
over the previous 130 nm process. Eventually, it was succeeded by smaller process nodes, such as the 65 nm, 45 nm, and 32 nm processes. It was commercialized
90_nm_process
Semiconductor device fabrication process
Per the International Technology Roadmap for Semiconductors, the 45 nm process is a MOSFET technology node referring to the average half-pitch of a memory
45_nm_process
Process in semiconductor device fabrication
The "22 nm" node is the process step following 32 nm in CMOS MOSFET semiconductor device fabrication. It was first demonstrated by semiconductor companies
22_nm_process
Semiconductor manufacturing node
The "32 nm" node is the step following the "45 nm" process in CMOS (MOSFET) semiconductor device fabrication. "32-nanometre" refers to the average half-pitch
32_nm_process
Semiconductor manufacturing processes
The 180 nm process is a MOSFET (CMOS) semiconductor process technology that was commercialized around the 1998–2000 timeframe by leading semiconductor
180_nm_process
Semiconductor manufacturing processes with a 350 nm MOSFET technology node
The 350 nanometer process (350 nm process) is a level of semiconductor process technology that was reached in the 1995–1996 timeframe by leading semiconductor
350_nm_process
Semiconductor manufacturing processes with a 800 nm MOSFET technology node
The 800 nm process (800 nanometer process) is a level of semiconductor process technology that was reached in the 1987–1990 timeframe, by companies, such
800_nm_process
Semiconductor manufacturing processes
The 130 nanometer (130 nm) process is a level of semiconductor process technology that was reached in the 2000–2001 timeframe by such leading semiconductor
130_nm_process
Semiconductor manufacturing processes with a 600 nm MOSFET technology node
The 600 nanometer process (600 nm process) is a level of semiconductor process technology that was reached in the 1994–1995 timeframe, by most leading
600_nm_process
Semiconductor manufacturing processes
The 250 nm process (250 nanometer process or 0.25 μm process) is a level of semiconductor process technology that was reached by most manufacturers in
250_nm_process
Semiconductor manufacturing process
The 1 μm process (1 micrometer process) is a level of MOSFET semiconductor process technology that was commercialized around the 1984–1986 timeframe, by
1_μm_process
32 KB instructions) per core. L2 cache: 1 MB per core. Fabrication process: 14 nm. X-suffix, and XE-suffix processors have an unlocked multiplier and can
List of Intel Core desktop processors
List_of_Intel_Core_desktop_processors
Elpida Memory's 90 nm DDR2 SDRAM process – 2005 IBM PowerPC G5 970MP – 2005 IBM PowerPC G5 970GX – 2005 IBM Waternoose Xbox 360 Processor – 2005 IBM–Sony–Toshiba
List of semiconductor scale examples
List_of_semiconductor_scale_examples
Semiconductor factory
be fully operational until 2024, when the 5 nm process is projected to be replaced by TSMC's 3 nm process as the latest technology. At launch it was expected
TSMC_Arizona
(ultra-low voltage) 1.1 GHz (low voltage) 1.2 GHz (low voltage) 1.3 GHz 1.4 GHz 1.5 GHz 1.6 GHz 1.7 GHz Dothan 0.09 μm (90 nm) process technology Introduced
List_of_Intel_processors
Manufacturing process used to create integrated circuits
example, Intel's former 10 nm process actually has features (the tips of FinFET fins) with a width of 7 nm, so the Intel 10 nm process is similar in transistor
Semiconductor device fabrication
Semiconductor_device_fabrication
Series of GPUs by Nvidia
65 nm process, later using 55 nm process to reduce power consumption and die size (GeForce 8 G8x GPUs only supported PCIe 1.1 and were built on 90 nm process
GeForce_9_series
Series of graphics cards by AMD
a 14 nm FinFET process, developed by Samsung Electronics and licensed to GlobalFoundries. Polaris 30 chips are produced on a 12 nm FinFET process, developed
Radeon_500_series
Intel microprocessor family launched in 2019
generation of Intel's 10 nm process, 10 nm+, Ice Lake is Intel's second microarchitecture to be manufactured on the 10 nm process, following the limited
Ice_Lake_(microprocessor)
Lithography using 13.5 nm UV light
and sells EUV systems for chip production, targeting 5 nanometer (nm) and 3 nm process nodes, though Reuters reported in December 2025 that China had developed
Extreme ultraviolet lithography
Extreme_ultraviolet_lithography
DIMMs of up to DDR3-1866 memory Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors 5 GT/s UMI Integrated
List of AMD processors with 3D graphics
List_of_AMD_processors_with_3D_graphics
Rule of thumb used in aviation
As a coincidence, 1 NM is about 6,000 feet (6,076.1 feet) so we can use the 60:1 rule for this too. For a 1 degree shift at 1 NM, there are about 100
1_in_60_rule
Line of CPUs produced by Intel
were the Core Solo and Core Duo Yonah processors for mobile from the Pentium M design tree, fabricated at 65 nm and brought to market in January 2006
Intel_Core
due to delays with the 10 nm process. Amber Lake: ultra low power, mobile-only successor to Kaby Lake, using 14+ nm process, released in August 2018 (no
List of Intel CPU microarchitectures
List_of_Intel_CPU_microarchitectures
Processor microarchitecture
with two or four active Wolfdale cores. Architecturally, 45 nm Core 2 processors feature SSE4.1 and new divide/shuffle engine. The chips come in two sizes
Intel Core (microarchitecture)
Intel_Core_(microarchitecture)
CPU used in the Xbox 360
reduced the fabrication process in 2007 to 65 nm from 90 nm, thus reducing manufacturing costs for Microsoft. 90 nm process, 65 nm process upgrade in 2007 (codenamed
Xenon_(processor)
Series of video cards
is a family of GPUs developed by AMD, and manufactured on TSMC's 28 nm process. The primary competitor of Southern Islands was Nvidia's GeForce 600 series
Radeon_HD_7000_series
models support: MMX, Enhanced 3DNow! Platform "Virgo" 32 nm fabrication on GlobalFoundries SOI process Socket FM2 CPU: Piledriver L1 Cache: 16 KB Data per
List_of_AMD_Athlon_processors
Series of CPUs by AMD
as Intel's first dual-core processor, the Pentium D. In June 2007, AMD released low-voltage variants of their low-end 65 nm Athlon 64 X2, named "Athlon
Athlon_64_X2
Semiconductor manufacturing process
The 1.5 μm process (1.5 micrometer process) is the level of MOSFET semiconductor process technology that was reached around 1981–1982, by companies such
1.5_μm_process
In microprocessor architecture
It comes in three versions, the 90 nm and 65 nm versions, and the 45 nm XCGPU with an integrated graphics processor from ATI. 64-bit, dual-threaded core
Power_Processing_Element
Brand by Intel
Hyper-Threading Technology (HTT). The first Pentium 4-branded processor to implement 64-bit was the Prescott (90 nm) (February 2004), but this feature was not enabled
Pentium_4
Intel microprocessor
fabricated in a 280 nm CMOS process with the same metal pitches as the previous 350 nm BiCMOS process, so Intel described it as "350 nm" because of its similar
Pentium_(original)
Semiconductor foundry company
14 nm 14LPP FinFET process from Samsung Electronics. In 2018 GlobalFoundries developed the 12 nm 12LP node based on Samsung's 14 nm 14LPP process. On
GlobalFoundries
2020 AMD 7-nanometer processor microarchitecture
2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen
Zen_3
Server and workstation processor line by AMD
a standard Opteron. Starting from 65 nm fabrication process, the Opteron codenames have been based on Formula 1 hosting cities; AMD has a long term sponsorship
Opteron
platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops
List_of_AMD_mobile_processors
Line of desktop and mobile microprocessors produced by Intel
fabricated in a 180 nm process. The Coppermine was available in 370-pin FC-PGA or FC-PGA2 for use with Socket 370, or in SECC2 for Slot 1 (all speeds except
Pentium_III
32-bit CPU for the Wii
central processing unit (CPU) used in Nintendo's Wii home video game console. It was designed by IBM, and was initially produced using a 90 nm SOI process and
Broadway_(processor)
Marketing name by AMD
formats. The Sempron replaced the AMD Duron processor and competed against Intel's Celeron series of processors. AMD coined the name from the Latin semper
Sempron
Series of microarchitectures and instruction set architecture by AMD
chips were fabricated with CMOS at 28 nm, and with FinFET at 14 nm (by Samsung Electronics and GlobalFoundries) and 7 nm (by TSMC), available on selected models
Graphics_Core_Next
Chinese semiconductor foundry
manufacturing services from 350 nm to 7 nm process technologies. The Financial Times reported that SMIC is expected to offer 5 nm process-node IC manufacturing
Semiconductor Manufacturing International Corporation
Semiconductor_Manufacturing_International_Corporation
System-on-chip processors designed by Apple Inc.
iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm. An updated 32 nm version of the A5 processor was used in the third-generation Apple TV
Apple_silicon
Technique used to increase the number of structures a microchip may contain
feature density. It is expected to be necessary for the 10 nm and 7 nm node semiconductor processes and beyond. The premise is that a single lithographic exposure
Multiple_patterning
Family of central processing unit models
Athlon II is a family of AMD multi-core 45 nm central processing units, which is aimed at the budget to mid-range market and is a complementary product
Athlon_II
Series of graphics cards by AMD
GlobalFoundries' 14 nm process; it also includes several rebranded, older products. The 400 series introduced the RX prefix, applied to cards capable of 1.5 TFlops
Radeon_400_series
Process of scaling down the size of semiconductor devices
65 nm CMOS) and Penryn Core 2 processors (from 65 nm CMOS to 45 nm CMOS), the codenamed Brisbane Athlon 64 X2 processors (from 90 nm SOI to 65 nm SOI)
Die_shrink
Intel processor family
on Palm Cove, a 10 nm die shrink of the Kaby Lake microarchitecture. As a die shrink, Palm Cove is a new process in Intel's process-architecture-optimization
Cannon_Lake_(microprocessor)
System-on-a-chip designed by Apple Inc.
iPhone 16 Pro, iPhone 16e and MacBook Neo, built on a second generation 3 nm process (N3E) by TSMC. Announced on September 9, 2024 and February 19, 2025, they
Apple_A18
Fundamental color in color mixing
original monochromatic primaries of the wavelengths of 435.8 nm (violet), 546.1 nm (green), and 700 nm (red) were used in this application due to the convenience
Primary_color
Series of video cards
series is a series of graphics processors developed by AMD. These GPUs are manufactured on a 28 nm Gate-Last process through TSMC or Common Platform
Radeon_200_series
DIMMs of up to DDR3-1866 memory Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors 5 GT/s UMI Integrated
List of AMD Athlon II processors
List_of_AMD_Athlon_II_processors
System-on-a-chip designed by Apple Inc.
variant of their 3 nm process node. Announced on September 9, 2025, they are the successors to the Apple A18 and Apple A18 Pro processors, respectively. Both
Apple_A19
64-bit CPU | the CPU Shack Museum". October 2019. "Intel Pentium 4 Processor on 90 nm Process, Specification Update, Document Number: 302352-031" (PDF). Intel
List of Intel Pentium 4 processors
List_of_Intel_Pentium_4_processors
Taiwanese semiconductor foundry company
of 7 nm process) 5 nm (options: FinFET (FF)) 4 nm (options: FinFET (FF), risk production started in 2021, enhanced version of 5 nm process) 3 nm (options:
TSMC
Semiconductor manufacturing process
μm process (6 micrometers) is the level of semiconductor process technology that was reached around 1974 by companies such as Intel. The 6 μm process refers
6_μm_process
and E6000 series use the same 45 nm Wolfdale-3M core as the E7000 series Core 2s, which has 3 MB L2 cache natively. 1 MB of L2 cache is disabled, for a
List of Intel Pentium processors
List_of_Intel_Pentium_processors
Semiconductor manufacturing processes
The 3 μm process (3 micrometer process) is the level of MOSFET semiconductor process technology that was reached around 1977, by companies such as Intel
3_μm_process
Series of CPUs by AMD
for Socket 939 and doubled Venice's L2 cache to 1 MB. Both were produced on the 90 nm fabrication process. Both also included support for the SSE3 instruction
Athlon_64
CPU microarchitecture by Intel
for Intel's 45 nm microarchitecture released in November 2008. It was used in the first generation of the Intel Core i5 and i7 processors, and is a major
Nehalem_(microarchitecture)
Process in microfabrication
S2CID 109584069. Wei, Yayi; Brainard, Robert L. (January 1, 2009). Advanced Processes for 193-nm Immersion Lithography. SPIE Press. ISBN 978-0-8194-7557-2
Photolithography
Intel CPU microarchitecture launched in 2019
fabricated using Intel's 10 nm process node. The microarchitecture is implemented in 10th-generation Intel Core processors for mobile (codenamed Ice Lake)
Sunny Cove (microarchitecture)
Sunny_Cove_(microarchitecture)
Intel VT-x, Smart Cache. Contains 45 nm "Ironlake" GPU. All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology
List of Intel Celeron processors
List_of_Intel_Celeron_processors
Family of Intel microprocessors
brand's first processor, codenamed Smithfield and manufactured on the 90 nm process, was released on May 25, 2005, followed by the 65 nm Presler nine months
Pentium_D
Ultraviolet light with a wavelength of 10–121nm
wavelengths shorter than the hydrogen Lyman-alpha line from 121 nm down to the X-ray band of 10 nm. By the Planck–Einstein equation the EUV photons have energies
Extreme_ultraviolet
Microprocessor brand name by Intel
designed in 45 nm complementary metal–oxide–semiconductor (CMOS) technology and subsequent models, codenamed Cedar, used a 32 nm process. The first generation
Intel_Atom
Family of 64-bit Intel microprocessors
delays left it at 90 nm competing against 65 nm and 45 nm processors. At ISSCC 2011, Intel presented a paper called "A 32nm 3.1 Billion Transistor 12-Wide-Issue
Itanium
Intel microprocessor family
November 4, 2021. It is fabricated using Intel's Intel 7 process, previously referred to as Intel 10 nm Enhanced SuperFin (10ESF). The 10ESF has a 10–15% boost
Alder_Lake
Protein found in humans
vesicles. Using cryo-EM it was shown that these are micellar tubes of ~5-6 nm diameter. Alpha-synuclein has also been shown to form lipid disc-like particles
Alpha-synuclein
Brand of discontinued microprocessors produced by Intel
14 nm process (e.g. the dual-core 1.9 GHz Intel Pentium 3805U with 2 MB cache). They used the FCBGA1168 socket. Skylake-based Pentium processors support
Pentium
SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x Models support only uni-processor configurations
List of Intel Xeon processors (Core-based)
List_of_Intel_Xeon_processors_(Core-based)
not just APUs with the iGPU disabled. Features of AMD Processors with 3D Graphics These processors were the first AMD CPUs to use the "FX" designation and
List_of_AMD_FX_processors
Intel processor family released in 2019
Core-branded processor family. They are manufactured using Intel's third 14 nm Skylake process revision, succeeding the Whiskey Lake U-series mobile processor and
Comet_Lake
Mammalian protein found in Homo sapiens
and nerol in cell-free extracts of Tanacetum vulgare". Phytochemistry. 15 (1): 91–100. Bibcode:1976PChem..15...91B. doi:10.1016/s0031-9422(00)89061-5.
Dimethylallyltranstransferase
Type of non-planar transistor
half of the 2010s, and became the dominant gate design at 14 nm, 10 nm and 7 nm process nodes. It is common for a single FinFET transistor to contain
Fin_field-effect_transistor
Intel processor microarchitecture
the company's 32 nm process; as the tock in Intel's Tick–tock model, it succeeds both Nehalem and Westmere. Sandy Bridge-based processors are marketed as
Sandy_Bridge
Enzyme that metabolizes substances by oxidation
SM, Atia NN, Hosny NM (2015). "Analysis for commonly prescribed non-sedating antihistamines". Analytical Chemistry Research. 3: 1–12. doi:10.1016/j.ancr
CYP3A4
traditional processors, the multiplier is the value multiplied by the speed of the FSB to get the clock speed of the processor. Turion processors have a memory
List_of_AMD_Turion_processors
Low-power mobile processors
processors use Socket S1 and feature DDR2 memory. They also include AMD Virtualization Technology and more power-saving features. The earlier 90 nm devices
AMD_Turion
32-bit multicore processor developed by SR1
than 1.5 mm2 when designed for a 65 nanometer (nm) generic process and can be clocked at speeds over 1 GHz, consuming less than 250 mW per core. Without
ARM_Cortex-A9
Line of discontinued microprocessors made by Intel
new 130 nm process which shrank the die size, increased the transistor count, and lowered the core voltage from 1.7 V on the Willamette-128 to 1.52 V for
Celeron
single-core desktop Athlon 64 processors used multiple core designs across two manufacturing process nodes (130 nm and 90 nm), with sockets ranging from
List of AMD Athlon 64 processors
List_of_AMD_Athlon_64_processors
CPU microarchitecture by Intel
microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock
Skylake_(microarchitecture)
Family of AMD multi-core 45 nm processors
Phenom II is a family of AMD's multi-core 45 nm processors using the AMD K10 microarchitecture, succeeding the original Phenom. Advanced Micro Devices
Phenom_II
Series of video cards
occurred on July 7, 2019. It is manufactured using TSMC's 7 nm FinFET semiconductor fabrication process. The Navi GPUs are the first AMD GPUs to use the new
Radeon_RX_5000_series
Pentium processors "Pentium iii Processor Datasheet - Page 10" (PDF). Retrieved 28 January 2019. "Intel Introduces Pentium® III Processor At 1.13 Gigahertz"
List of Intel Pentium III processors
List_of_Intel_Pentium_III_processors
Unit of length
spelling as used by the International Bureau of Weights and Measures; SI symbol: nm), or nanometer (American spelling), is a unit of length in the International
Nanometre
Number of transistors in a device
7 nm FinFET process. As of 2026[update], the GPU with the highest transistor count is Nvidia's Rubin accelerator, built on TSMC's custom N3P process node
Transistor_count
is actually at 180 nm 27.4 million transistors die size 180 mm2 List of Intel Pentium processors List of Intel Pentium Pro processors List of Intel Pentium
List of Intel Pentium II processors
List_of_Intel_Pentium_II_processors
Observation on the growth of integrated circuit capacity
double-patterning processes were invented by Gurtej Singh Sandhu at Micron Technology, extending Moore's law for planar CMOS technology to 30 nm class and smaller
Moore's_law
CPU microarchitecture
branded processors used in systems on a chip (SoCs) made by Intel. It is the successor to Goldmont Plus. Intel launched Elkhart Lake platform with 10 nm Tremont
Tremont_(microarchitecture)
1 NM-PROCESS
1 NM-PROCESS
Boy/Male
Muslim
Good, Delicate (1)
Girl/Female
Muslim
Favor, Grace (1)
Girl/Female
Muslim
Flower, Fruit (1)
Boy/Male
Muslim
Skillful, Adroit (1)
Boy/Male
Muslim
Scratching, Scraping (1)
Surname or Lastname
North German form of Fries 1.Dutch
North German form of Fries 1.Dutch : variant of Frese.English : metonymic occupational name for a weaver of frieze, a coarse woolen cloth with a thick nap, Old French frise.
Girl/Female
Muslim
Serene, Tranquil (1)
Boy/Male
Shakespearean
King Henry IV, Part 1' Earl of March. Scroop.
Girl/Female
Muslim
Splendid, Glorious (1)
Girl/Female
Muslim
Brilliant, Splendid (1)
Boy/Male
Muslim
Fascinating, Attractive (1)
Boy/Male
Muslim
Cornice, Eaves (1)
Boy/Male
Muslim
Mighty, Powerful (1)
Girl/Female
Muslim
Victory, Successful (1)
Girl/Female
Muslim
Just, Equitable (1)
Girl/Female
Muslim
Morning, Dawn (1)
Boy/Male
Muslim
Longing, Craving (1)
Boy/Male
Muslim
Noble, Intelligent (1)
Surname or Lastname
Scottish spelling of Irish Morey 1.English and French
Scottish spelling of Irish Morey 1.English and French : from the personal name Amaury (see Morey 2).
Girl/Female
Muslim
Tall, Towering (1)
1 NM-PROCESS
1 NM-PROCESS
Boy/Male
American, Danish, Finnish, French, German, Hebrew, Hindu, Indian, Slovenia, Swedish
The Lord is Gracious
Male
Celtic
, an epithet of the war god Mars.
Girl/Female
Tamil
Jallavi | ஜலà¯à®²à®¾à®µà¯€
Boy/Male
Arthurian Legend
Various names for Arthur's sword.
Boy/Male
Native American
High chief.
Boy/Male
Gujarati, Hindu, Indian, Kannada, Malayalam, Marathi, Telugu
Lord Shiva
Boy/Male
Gujarati, Hindu, Indian, Kannada
Born on Sunday
Boy/Male
Indian, Punjabi, Sikh
Pure Lamp
Boy/Male
Hindu, Indian
Mist; Fog
Girl/Female
American, Australian, Chinese, Greek, Spanish
High Tower; Woman from Magdala; Similar to Madeleine
1 NM-PROCESS
1 NM-PROCESS
1 NM-PROCESS
1 NM-PROCESS
1 NM-PROCESS
n.
See Snowbird, 1.
n.
See Monogenesis, 1.
n.
See Erythrite, 1.
n.
Amaranth, 1.
n.
Latten, 1.
n.
See Rondeau, 1.
n.
See Villain, 1.
n.
The snakebird, 1.
n.
See Jetsam, 1.
a.
See Umbilical, 1.
n.
See Rondo, 1.
n.
An East Indian Weight of 1 1/3 pounds.
n.
See Grayling, 1.
n.
A term made up of the two parts / + /1 /-1, where / and /1 are vectors.
n.
See Pintail, 1.
n.
See Veronica, 1.
n.
See Keeler, 1.
n.
See Manilla, 1.
n.
See Toque, 1.
n.
See Snowbird, 1.