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MOSFET technology node
The 14 nanometer process is a marketing term for the MOSFET technology node that is the successor to the 22 nm (or 20 nm) node. The 14 nm was so named
14_nm_process
Process in semiconductor device fabrication
The 22 nm node is the process step following 32 nm in CMOS MOSFET semiconductor device fabrication. It was first demonstrated by semiconductor companies
22_nm_process
Semiconductor manufacturing process
manufacturing, the 2 nm process is the MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node. The term "2 nanometer"
2_nm_process
MOSFET technology node
defines the "10 nanometer process" as the MOSFET technology node following the "14 nm" node. Since at least 1997, "process nodes" have been named purely
10_nm_process
Semiconductor manufacturing processes
defines the "5 nm" process as the MOSFET technology node following the "7 nm" node. In 2020, Samsung and TSMC entered volume production of "5 nm" chips, manufactured
5_nm_process
Semiconductor manufacturing process
In semiconductor manufacturing, the "3 nm process" is the next die shrink after the "5 nm" MOSFET (metal–oxide–semiconductor field-effect transistor) technology
3_nm_process
Manufacturing process used to create integrated circuits
similar in transistor density to TSMC's 7 nm process. As another example, GlobalFoundries' 12 and 14 nm processes have similar feature sizes. In 1955, Carl
Semiconductor device fabrication
Semiconductor_device_fabrication
using 14++ nm process, released in October 2017 Cascade Lake: server and high-end desktop successor to Kaby Lake-X and Skylake-X, using 14++ nm process, released
List of Intel CPU microarchitectures
List_of_Intel_CPU_microarchitectures
Semiconductor device fabrication process
Per the International Technology Roadmap for Semiconductors, the 45 nm process is a MOSFET technology node referring to the average half-pitch of a memory
45_nm_process
MOSFET technology node
In semiconductor manufacturing, the "7 nm" process is a term for the MOSFET technology node following the "10 nm" node, defined by the International Roadmap
7_nm_process
Advanced lithographic node used in volume CMOS semiconductor fabrication
25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm. For comparison, cellular ribosomes are about 20 nm end-to-end
65_nm_process
Semiconductor manufacturing node
The 32 nm node is the step following the 45 nm process in CMOS (MOSFET) semiconductor device fabrication. "32-nanometre" refers to the average half-pitch
32_nm_process
Semiconductor manufacturing processes with a 600 nm MOSFET technology node
The 600 nanometer process (600 nm process) is a level of semiconductor process technology that was reached in the 1994–1995 timeframe, by most leading
600_nm_process
Intel CPU microarchitecture launched in 2019
desktop processors (codenamed Rocket Lake). Cypress Cove is a version of the Sunny Cove microarchitecture backported to Intel's 14 nm process node. The
Sunny Cove (microarchitecture)
Sunny_Cove_(microarchitecture)
Eighth-generation Intel Core microprocessor family
2017. It is manufactured using Intel's second 14 nm process node refinement. Desktop Coffee Lake processors introduced i5 and i7 CPUs featuring six cores
Coffee_Lake
Intel microprocessor released in 2021
variant of Sunny Cove (used by Intel's Ice Lake mobile processors) backported to Intel's 14 nm process node. Rocket Lake cores contain significantly more
Rocket_Lake
Chinese semiconductor foundry
manufacturing services from 350 nm to 7 nm process technologies. The Financial Times reported that SMIC is expected to offer 5 nm process-node IC manufacturing
Semiconductor Manufacturing International Corporation
Semiconductor_Manufacturing_International_Corporation
Intel processor family
on Palm Cove, a 10 nm die shrink of the Kaby Lake microarchitecture. As a die shrink, Palm Cove is a new process in Intel's process-architecture-optimization
Cannon_Lake_(microprocessor)
2020 AMD 7-nanometer processor microarchitecture
2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen
Zen_3
Fifth generation of Intel Core processors
shrink of its predecessor, Haswell, manufactured with the newer 14 nm FinFET process node. Broadwell-based products are marketed as the fifth generation
Broadwell_(microarchitecture)
AMD brand of server microprocessors
processors codenamed "Rome" and based on the Zen 2 microarchitecture. The processors feature up to eight 7 nm-based "chiplet" processors with a 14 nm-based
Epyc
Specialized electronic circuit that accelerates graphics
hardware. Polaris 11 and Polaris 10 GPUs from AMD are fabricated by a 14 nm process. Their release resulted in a substantial increase in the performance
Graphics_processing_unit
Series of graphics cards by AMD
the GCN 4 microarchitecture, and manufactured with GlobalFoundries' 14 nm process; it also includes several rebranded, older products. The 400 series
Radeon_400_series
Brand of discontinued microprocessors produced by Intel
a 14 nm process (e.g. the dual-core 1.9 GHz Intel Pentium 3805U with 2 MB cache). They used the FCBGA1168 socket. Skylake-based Pentium processors support
Pentium
Line of CPUs produced by Intel
Following similar refinements to the 14 nm process in Skylake and Kaby Lake, Coffee Lake is the third 14 nm process refinement ("14nm++") and features increased
Intel_Core
Taiwanese engineer (born 1952)
nm process to the 20-nanometer process. Liang advocated that Samsung abandon the 20 nm process and directly upgrade from the 28 nm process to the 14 nm
Liang_Mong_Song
Series of graphics cards by AMD
a 14 nm FinFET process, developed by Samsung Electronics and licensed to GlobalFoundries. Polaris 30 chips are produced on a 12 nm FinFET process, developed
Radeon_500_series
Series of GPUs by Nvidia
incorporates either 16 nm FinFET (TSMC) or 14 nm FinFET (Samsung) technologies. Initially, chips were only produced in TSMC's 16 nm process, but later chips
GeForce_10_series
Baidu semiconductor subsidiary
built a dedicated silicon that was built using one of Samsung Foundry's 14 nm process. In July 2018, Baidu unveiled the Kunlun AI chip to the public marking
Kunlunxin
Semiconductor factory
be fully operational until 2024, when the 5 nm process is projected to be replaced by TSMC's 3 nm process as the latest technology. At launch it was expected
TSMC_Arizona
Microprocessor family released in 2016
improved 14 nm process (14FF+), Kaby Lake features faster CPU clock speeds, clock speed changes, and higher Turbo frequencies. Beyond these process and clock
Kaby_Lake
Production model by Intel
focusing on optimization. After introducing the Skylake architecture on a 14 nm process in 2015, its first optimization was Kaby Lake in 2016. Intel then announced
Tick–tock_model
feature 128 MB of eDRAM, acting as L4 cache. Fabrication process: 14 nm. K-suffix processors have an unlocked multiplier, allowing it to be overclocked
List of Intel Core mobile processors
List_of_Intel_Core_mobile_processors
Type of computer memory
DRAM. Samsung's implementation involves 16-gigabit (2 GB) dies, on a 14 nm process node, with modules with up to 32 dies (64 GB) in a single package. According
LPDDR
It provides integrated circuit (IC) manufacturing services on 350 nm to 14 nm process technologies. State-owned civilian and military telecommunications
Semiconductor industry in China
Semiconductor_industry_in_China
Hardware used in Tesla autonomous driving systems
Tesla-designed system on a chip called "FSD Chip", fabricated using a 14 nm process by Samsung. Jim Keller and Pete Bannon, among other architects, have
Tesla_Autopilot_hardware
2017 AMD 14-nanometer processor microarchitecture
previous long-standing Bulldozer architecture. Zen-based processors use a 14 nm FinFET process, are reportedly more energy efficient, and can execute significantly
Zen_(first_generation)
Intel microprocessor, released in 2018
mobile processors. Intel announced Whiskey Lake on August 28, 2018. 14++ nm process, same as Coffee Lake Increased turbo clocks (300–600 MHz) 14 nm PCH Native
Whiskey_Lake
lines. AMD Zen Family 17h – first generation Zen architecture based on 14 nm process. First AMD architecture to implement simultaneous multithreading and
List of AMD CPU microarchitectures
List_of_AMD_CPU_microarchitectures
Intel microprocessor family launched in 2019
generation of Intel's 10 nm process, 10 nm+, Ice Lake is Intel's second microarchitecture to be manufactured on the 10 nm process, following the limited
Ice_Lake_(microprocessor)
uses 14 nm FinFET technology. Samsung announced that it had begun mass production of multi-level cell (MLC) flash memory chips using a 10 nm process in
List of semiconductor scale examples
List_of_semiconductor_scale_examples
2018 AMD 12-nanometre processor microarchitecture
for accelerated processing units (APUs). Zen+ uses GlobalFoundries' 12 nm fabrication process, an optimization of the 14 nm process used for Zen, with
Zen+
2022 AMD 5-nanometer processor microarchitecture
5 nm process and one I/O die built on 6 nm. Previously, the I/O die on Zen 3 was built on GlobalFoundries' 14 nm process for EPYC and 12 nm process for
Zen_4
Custom or semi-custom ARM-based CPU series
(Performance cluster) and 512 KB L2 cache for (Efficiency cluster) Samsung 14 nm LPP Process Performance core+L2 die size: 2.79mm2 The Kryo 200 Series CPUs is
Kryo
2019 AMD 7-nanometer processor microarchitecture
a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node
Zen_2
Fabrication process: 14 nm. C-suffix processors supports Unlocked Multiplier. Common features of Core i (5th gen) Haswell-E desktop processors: Socket: LGA
List of Intel Core desktop processors
List_of_Intel_Core_desktop_processors
Series of GPUs by Nvidia
65 nm process, later using 55 nm process to reduce power consumption and die size (GeForce 8 G8x GPUs only supported PCIe 1.1 and were built on 90 nm process
GeForce_9_series
chipsets are made using 55 nm lithography. The X570 chipset is a repurposed Matisse/Vermeer IO die made using a 14 nm process. Supports both 1st and 2nd
List_of_AMD_chipsets
American multinational technology company
ushering in the process–architecture–optimization model. As Intel struggled to shrink its process node from 14 nm to 10 nm, processor development slowed
Intel
2017 64-bit mainframe microprocessor by IBM
transistors. It is fabricated using GlobalFoundries' 14 nm FinFET silicon on insulator fabrication process, using 17 layers of metal and supporting speeds
IBM_z14
CPU used in the Xbox 360
reduced the fabrication process in 2007 to 65 nm from 90 nm, thus reducing manufacturing costs for Microsoft. 90 nm process, 65 nm process upgrade in 2007 (codenamed
Xenon_(processor)
suffixes that are not shown here. Skylake (Core i3 6th generation) – 14 nm process technology 2 physical cores/4 threads 3–4 MB L3 cache Introduced Q3'15
List_of_Intel_processors
Chinese EDA Company
Huawei announced that it would use domestic EDA software capable of the 14 nm process with Empyrean being speculated to be the reason for the breakthrough
Empyrean_Technology
Series of x86 manycore processors from Intel
available in two forms, as a coprocessor or a host processor (CPU), and be manufactured using Intel's 14 nm process technology. Knights Landing products will include
Xeon_Phi
Chinese semiconductor equipment manufacturer
The company's products were used in 14 nm process and above. It had also carried out testing in 10 nm process and below. Its customers included SMIC
Piotech
2012. Retrieved December 8, 2008. "Top Secret Intel Processor Plans Uncovered: Intel Focusing On 45 Nm Now". Tom's Hardware Guide. December 4, 2005. Retrieved
List_of_Intel_codenames
64-bit CPU | the CPU Shack Museum". October 2019. "Intel Pentium 4 Processor on 90 nm Process, Specification Update, Document Number: 302352-031" (PDF). Intel
List of Intel Pentium 4 processors
List_of_Intel_Pentium_4_processors
Small form factor PC designed by Intel
are based on 5th generation Celeron and Pentium-branded Braswell 14 nm processor family. There is also the UCFF complete system (NUC5PGYH) model, formerly
Next_Unit_of_Computing
2020 smartphone model
Kirin 710A processor manufactured using a 14 nm process, while the Play 3 uses the Kirin 710F manufactured on a 12 nm process. Both processors are paired
Honor_9C
Series of microarchitectures and instruction set architecture by AMD
allows GCN processors to perform general-purpose computing (GPGPU). GCN graphics chips were fabricated with CMOS at 28 nm, and with FinFET at 14 nm (by Samsung
Graphics_Core_Next
Common features: All processors support up to 128 GB of DDR4-2933. -E: embedded -P: high performance (and power), with cTDP down to 95 W -T: low power
List of Intel Xeon processors (Comet Lake-based)
List_of_Intel_Xeon_processors_(Comet_Lake-based)
Process of scaling down the size of semiconductor devices
65 nm CMOS) and Penryn Core 2 processors (from 65 nm CMOS to 45 nm CMOS), the codenamed Brisbane Athlon 64 X2 processors (from 90 nm SOI to 65 nm SOI)
Die_shrink
Series of video cards
is a family of GPUs developed by AMD, and manufactured on TSMC's 28 nm process. The primary competitor of Southern Islands was Nvidia's GeForce 600 series
Radeon_HD_7000_series
Type of non-planar transistor
first half of the 2010s, and became the dominant gate design at 14 nm, 10 nm and 7 nm process nodes. It is common for a single FinFET transistor to contain
Fin_field-effect_transistor
Marketing name by AMD
formats. The Sempron replaced the AMD Duron processor and competed against Intel's Celeron series of processors. AMD coined the name from the Latin semper
Sempron
Chiappetta, Marco (30 March 2017). "Intel Releases New Xeon E3-1200 V6 Series Processors For Entry-Level Pro Workstations And Servers". Forbes. Retrieved 18 December
List of Intel Xeon processors (Kaby Lake-based)
List_of_Intel_Xeon_processors_(Kaby_Lake-based)
American electrical engineer (born 1984)
of SOT-MRAM combined with Fin field-effect transistors in 22 nm process and 14 nm process at various foundries. Working with Jian-Ping Wang, Manipatruni
Sasikanth_Manipatruni
Series of modems for mobile devices by Intel
up to 6 Gbit/s Sub-6 GHz and 26/28/39 GHz mmWave Intel 14 nm process Cancelled as of November 14, 2018 Protocols: LTE Advanced Pro, FDD/TDD, DC-HSPA+,
Intel_XMM_modems
Intel processor family released in 2019
Core-branded processor family. They are manufactured using Intel's third 14 nm Skylake process revision, succeeding the Whiskey Lake U-series mobile processor and
Comet_Lake
Enzyme involved in estrogen production
Aromatase (EC 1.14.14.14), also called estrogen synthetase or estrogen synthase, is an enzyme responsible for a key step in the biosynthesis of estrogens
Aromatase
up to four DIMMs of up to DDR3-1866 memory Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors 5 GT/s
List of AMD processors with 3D graphics
List_of_AMD_processors_with_3D_graphics
Series of microprocessors
manufactured in a 250 nm CMOS process 18 million transistors HSBGA292 package Russian: 1892ВМ3Т (MC-12) 2 cores: RISCore32 + ELcore-14 (DSP-core with SISD
ELVEES_Multicore
models support: MMX, Enhanced 3DNow! Platform "Virgo" 32 nm fabrication on GlobalFoundries SOI process Socket FM2 CPU: Piledriver L1 Cache: 16 KB Data per
List_of_AMD_Athlon_processors
has announced products in .25 um, .18 um, .13 um, 90 nm, 65 nm, 40 nm, 28 nm and 14 nm process technologies. In 2017, eSilicon announced tapeout to production
ESilicon
Microarchitecture family by AMD
first iteration of Zen utilized GlobalFoundries' 14 nm manufacturing process. Modified Zen-based processors for the Chinese market were also built under the
Zen_(microarchitecture)
Android smartphone model released in 2019
powered by a 1.6 GHz octa-core Exynos 7870 chipset which is based on a 14 nm process and offers eight ARM Cortex-A53 cores clocked at 1.6 GHz. The phone
Samsung_Galaxy_M10
XD bit (an NX bit implementation), Intel VT-x, Smart Cache. Contains 45 nm "Ironlake" GPU. All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4
List of Intel Celeron processors
List_of_Intel_Celeron_processors
System-on-a-chip designed by Apple Inc.
iPhone 16 Pro, iPhone 16e and MacBook Neo, built on a second generation 3 nm process (N3E) by TSMC. Announced on September 9, 2024, they are the successors
Apple_A18
Processor microarchitecture
quad-core processors except - are multi-chip modules combining two dies. For the 65 nm processors, the same product code can be shared by processors with different
Intel Core (microarchitecture)
Intel_Core_(microarchitecture)
single-core desktop Athlon 64 processors used multiple core designs across two manufacturing process nodes (130 nm and 90 nm), with sockets ranging from
List of AMD Athlon 64 processors
List_of_AMD_Athlon_64_processors
GPU microarchitecture by Nvidia
respectively. Pascal was manufactured using TSMC's 16 nm FinFET process, and later Samsung's 14 nm FinFET process. The architecture is named after the 17th century
Pascal_(microarchitecture)
features table Launched in 2003, the initial platform for mobile AMD processors consists of: MMX, SSE, SSE2, Enhanced 3DNow!, NX bit MMX, SSE, SSE2, Enhanced
List_of_AMD_mobile_processors
2018 mid-range smartphone by Samsung Electronics
Octa chipset, built on a 14 nm process with an octa‑core processor running at 1.6 GHz and an ARM Mali-T830 MP1 graphics processing unit, making it suitable
Samsung_Galaxy_J7_(2018)
material may be challenged and removed. Find sources: "List of Intel Xeon processors" Cascade Lake–based – news · newspapers · books · scholar · JSTOR (December
List of Intel Xeon processors (Cascade Lake–based)
List_of_Intel_Xeon_processors_(Cascade_Lake–based)
Lithography using 13.5 nm UV light
and sells EUV systems for chip production, targeting 5 nanometer (nm) and 3 nm process nodes, though Reuters reported in December 2025 that China had developed
EUV_lithography
the processor). Additional frequency = turbo bins * Base clock (100 MHz for Sandy Bridge, Ivy Bridge, Haswell, Broadwell, and Skylake processors). Not
List of Intel Xeon processors (Skylake-based)
List_of_Intel_Xeon_processors_(Skylake-based)
(PowerVR G6430) and memory controller are integrated onto the processor die Package size: 14 mm × 14 × 1.0 mm SoFIA (smart or feature phone with Intel architecture)
List_of_Intel_Atom_processors
Family of Intel microprocessors
brand's first processor, codenamed Smithfield and manufactured on the 90 nm process, was released on May 25, 2005, followed by the 65 nm Presler nine months
Pentium_D
Archived from the original on 2017-10-09. Retrieved 2010-11-14. "Intel's Pentium III 1.2GHz processor". techreport.com. Retrieved 3 August 2022. "from CPU-World"
List of Intel Pentium III processors
List_of_Intel_Pentium_III_processors
CPU microarchitecture
and Pentium Silver branded processors used in systems on a chip (SoCs) made by Intel. The Gemini Lake platform with 14 nm Goldmont Plus core was officially
Goldmont_Plus
Taiwanese semiconductor foundry company
of 7 nm process) 5 nm (options: FinFET (FF)) 4 nm (options: FinFET (FF), risk production started in 2021, enhanced version of 5 nm process) 3 nm (options:
TSMC
Number of transistors in a device
7 nm FinFET process. As of 2026[update], the GPU with the highest transistor count is Nvidia's Rubin accelerator, built on TSMC's custom N3P process node
Transistor_count
series. Other related processors based on the K10 microarchitecture include the Athlon X2 Kuma processors, Athlon II processors, and various Opteron,
List_of_AMD_Phenom_processors
Intel microprocessor
fabricated in a 280 nm CMOS process with the same metal pitches as the previous 350 nm BiCMOS process, so Intel described it as "350 nm" because of its similar
Pentium_(original)
Graphics chip used in the Nintendo Wii
efficient data access. The initial Hollywood-A revision was built on a 90 nm process and contained three dies. The first die, codenamed Vegas, handled most
Hollywood_(graphics_chip)
Semiconductor manufacturing process
μm process (6 micrometers) is the level of semiconductor process technology that was reached around 1974 by companies such as Intel. The 6 μm process refers
6_μm_process
Microprocessor designed and produced in China for supercomputing applications
4096 Galaxy FT-1500 processors with 16 cores, OpenSPARC architecture based and 65 W TDP. They are made with 40 nm technology, processor cores work at 1.8 GHz
FeiTeng
Series of video cards
series is a series of graphics processors developed by AMD. These GPUs are manufactured on a 28 nm Gate-Last process through TSMC or Common Platform
Radeon_200_series
Protein found in humans
components for dynamic biological processes. An essential function of a modified proteasome, the immunoproteasome, is the processing of class I MHC peptides. The
PSMB5
Enzyme that metabolizes substances by oxidation
040. PMC 6698236. PMID 31427846. El-Kommos ME, El-Gizawy SM, Atia NN, Hosny NM (2015). "Analysis for commonly prescribed non-sedating antihistamines". Analytical
CYP3A4
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