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Historical electronic computer module design
Flip-Chip module A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9
Flip-Chip_module
Technique that flips a microchip upside down to connect it
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices
Flip_chip
Electronic assembly containing multiple integrated circuits that behaves as a unit
conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large
Multi-chip_module
American computer manufacturer (1957–1998)
were then packaged as the first "R" (red) series "Flip-Chip" modules. Later, other Flip-Chip module series provided additional speed, much higher logic
Digital_Equipment_Corporation
Electronic circuit with two stable states
Equipment Corporation's Logic Handbook Flip Chip™ Modules 1969 edition describes "R/S Flip-Flops" and 'Clocked' "R/S Flip-Flops" accompanied by a truth table
Flip-flop_(electronics)
36-bit mainframe computer (1964–1966)
its re-implementation using modern silicon transistors and the newer Flip-Chip module packaging to produce the PDP-10. The instruction sets of the two machines
PDP-6
Distinguishing characteristic of a program
use wire wrap, as well as being the first to use the proprietary DEC Flip-Chip module which was invented in the same year. Feature also applies to concepts
Software_feature
IBM computer circuit board, circa 1960
same 1401 card cage IBM 7070 card cage IBM Solid Logic Technology Flip-Chip module Boyer, Chuck (April 2004). "The 360 Revolution" (PDF). IBM. p. 18.
Standard_Modular_System
Minicomputer product line
and other options, required 75 small modules and 25 double-size modules, all but 2 from the R series Flip-Chip module family. The PDP-8/S model, introduced
PDP-8
Method of circuit board manufacture
device) with the conductive traces of the printed circuit board. In "flip chip on board", the device is inverted, with the top layer of metallization
Chip_on_board
Computer memory module
multiple companies. The original memory modules were built upon ceramic substrates with 64K Hitachi "flip chip" parts and had pins, i.e. single in-line
SIMM
Electronic circuit formed on a small, flat piece of semiconductor material
communication between modules on the same chip. This has led to an exploration of so-called network-on-chip (NoC) devices, which apply system-on-chip design methodologies
Integrated_circuit
Name used for several lines of minicomputers
for the PDP-4; DEC's first wire-wrapped machine using the associated Flip-Chip module form-factor. It was introduced in 1964, and a second version, the 7A
Programmed_Data_Processor
Surface-mount packaging that uses an array of solder balls
may be used on both the PCB and the package. Also, in stacked multi-chip modules, solder balls are used to connect two packages in a "package on package"
Ball_grid_array
Circuit board within a computer
be an inverter or flip-flop, which would require two or more transistors and a small number of additional supporting devices. Modules would be inserted
Computer_module
Industrial computer from Digital
traditionally required for this work. These modules were in the company's M series of Flip-Chip modules, which used TTL circuit technology. The economic
PDP-16
Class of digital circuits
(PDF) on 2011-03-22. Retrieved 2011-09-09. The Digital Logic Handbook Flip Chip Modules. Digital Equipment Corporation. 1967. 1750·3/67. Retrieved 2008-03-08
Resistor–transistor_logic
36-bit computer by Digital (1966–1983)
KA10, introduced in 1968. It uses discrete transistors packaged in DEC's Flip-Chip technology, with backplanes wire-wrapped via a semi-automated manufacturing
PDP-10
Thermoelectric Copper Device
embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging
Thermal_copper_pillar_bump
connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead
List of electronic component packaging types
List_of_electronic_component_packaging_types
Processor by Rockchip
The Rockchip RK3288 is an ARM architecture System on Chip (SoC) from Rockchip. It is the first SoC, in August 2014, that uses the 32-bit ARM Cortex-A17
Rockchip_RK3288
American computer company
the PCM-12 with additional instruction sets based on DEC's DR8-EA Flip-Chip module, which aided in the fields of data acquisition and process control
Pacific_Cyber/Metrix
Self-correcting computer data storage
spontaneously flip to the opposite state. It was initially thought that this was mainly due to alpha particles emitted by contaminants in chip packaging material
ECC_memory
2021 Intel CPU socket
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors based on Alder Lake and
LGA_1700
Electronic component
package substrate. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together and to the package substrate, or
System_in_a_package
Intel microprocessor
Deschutes core in a flip-chip package with a 512 KB full-speed L2 cache chip from the Pentium II Xeon into a Socket 8-compatible module resulted in a processor
Pentium_II
2017 family of multi-core microprocessors by IBM
lists the three available modules for the Nimbus chip, although the Scale-Out SMT8 variant for PowerVM also uses the LaGrange module/socket: Sforza – 50 mm
POWER9
Connection method for surface-mounted chips
the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they
Solder_ball
Electrical connection
high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives
Through-silicon_via
Integrated circuit packaging method
Stackable Flip Chip Chip Scale Package In 2001, a Toshiba research team including T. Imoto, M. Matsui and C. Takubo developed a "System Block Module" wafer
Package_on_a_package
Form of computer data storage
(CL) Chip creep Electrochemical RAM Hybrid Memory Cube List of RAM chip manufacturers List of RAM module manufacturers Memory geometry Memory module Multi-channel
Random-access_memory
Integrated circuit composed of several vertically stacked chips
rely on traditional interconnection methods such as wire bonding and flip chip to achieve vertical stacking. 3D packaging can be divided into 3D system
Three-dimensional integrated circuit
Three-dimensional_integrated_circuit
2020 foldable smartphone by Samsung Electronics
The Samsung Galaxy Z Flip is a foldable smartphone developed and designed by Samsung Electronics as part of the Galaxy Z series, released on February 14
Samsung_Galaxy_Z_Flip
IBM hybrid circuit technology introduced in 1964
discrete, flip chip-mounted, glass-encapsulated transistors and diodes, with silk-screened resistors on a ceramic substrate, forming an SLT module. The circuits
Solid_Logic_Technology
structure inside a package that connects the chip to its leads mask – see photomask MCM – see multi-chip module microbump – a very small solder ball that
Glossary of microelectronics manufacturing terms
Glossary_of_microelectronics_manufacturing_terms
1970 model of the DEC PDP-8 line of minicomputers
CPU was built using DEC M-series Flip Chip modules
PDP-8/e
Intel microprocessor series released in 2023
use a chiplet architecture which means that the processor is a multi-chip module. Meteor Lake's design effort was led by Tim Wilson. In July 2021, Meteor
Meteor_Lake
Places a microchip on a flexible circuit board
advantage of TAB has diminished with the development of the flip chip manufacturing, because flip chip uses soldering which also with the time has developed
Tape-automated_bonding
Type of surface-mount packaging for integrated circuits
socket Chip carrier Dual in-line package (DIP) Pin grid array (PGA) Ball grid array (BGA) Compression Attached Memory Module (CAMM), a memory module form
Land_grid_array
Intel CPU socket
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy
LGA_1155
Final stage of semiconductor device fabrication
to manufacture. Wire bonding can be used instead of techniques such as flip-chip to reduce costs. Early integrated circuits were packaged in ceramic flat
Integrated_circuit_packaging
2020 family of multi-core microprocessors by IBM
flip-chip plastic land grid array (FC-PLGA) packages: one single chip module (SCM) and two dual-chip modules (DCM and eSCM). SCM, single chip module –
Power10
AI accelerator ASIC by Google
then arranged into four-chip modules with a performance of 180 teraFLOPS. Then 64 of these modules are assembled into 256-chip pods with 11.5 petaFLOPS
Tensor_Processing_Unit
Multiple electronic componets in a single package
module substrate, and therefore be part of a hybrid module, multi-chip module or chiplet module/implementation. The substrate for IPDs can be rigid like
Integrated_passive_devices
Style of synthesized electronic music
his own Jes Say Records label. "Carlsson, Anders "Goto80": Chip music timeline". ChipFlip. February 19, 2008. Archived from the original on May 26, 2020
Chiptune
Modules used in early PDP computers
System Modules (originally known as System Building Blocks; the name was changed around 1961) are a DEC modular digital logic family which preceded FLIP CHIPs
DEC_System_Module
Type of computer memory
its first product, Intel 3101, a SRAM memory chip intended to replace bulky magnetic-core memory modules; Its capacity was 64 bits and was based on bipolar
Static_random-access_memory
Series of IBM mainframe computer models from 1980s
the Thermal Conduction Module (TCM), a flat ceramic module containing about 30,000 logic circuits on up to 118 chips. The TTL chips (which were not compatible
IBM_308X
CPU socket for Intel desktop processors
LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake
LGA_1200
Casing for integrated circuit or semiconductor components
same package. In a technique called flip chip, digital integrated circuit dies are inverted and soldered to a module carrier, for assembly into large systems
Semiconductor_package
Manufacturing process used to create integrated circuits
edges of the die, however, Flip-chip packaging can be used to place bond pads across the entire surface of the die. Chip scale package (CSP) is another
Semiconductor device fabrication
Semiconductor_device_fabrication
Collection of microscopic DNA spots attached to a solid surface
A DNA microarray (also commonly known as a DNA chip or biochip) is a collection of microscopic DNA spots attached to a solid surface. Scientists use DNA
DNA_microarray
Series of microprocessors from IBM
floating point operations. POWER2 – 6 to 8 chips were mounted on a ceramic multi chip module POWER2+ – a cheaper 6-chip version of POWER2 with support for external
IBM_Power_microprocessors
Applies an electric current to heat or cool materials
effect). A thermoelectric module is made from three components: the conductors, the legs, and the substrate. Many of these modules are connected electrically
Thermoelectric_heat_pump
Intel microprocessor compatible socket
LGA 1151, also known as Socket H4, is a type of zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in
LGA_1151
Type of computer memory
single bit of DRAM to spontaneously flip to the opposite state. The majority of one-off ("soft") errors in DRAM chips occur as a result of background radiation
Dynamic_random-access_memory
Microprocessor developed by Intel
Pentium II in a flip-chip package with a 512 kB full-speed L2 cache chip from the Pentium II Xeon into a Socket 8-compatible module, this resulted in
Pentium_OverDrive
Power management technique for synchronous digital circuits
extends clock gating beyond individual flip-flops to optimise power savings across larger circuit portions. Chips designed for battery-powered or ultra-low-power
Clock_gating
Topics referred to by the same term
incorrectly referred to as the C4 chip) Controlled collapse chip connection or flip chip, a method for interconnecting semiconductor devices VIA C4, a
C4
Array of logic gates that are reprogrammable
most FPGAs, logic blocks also include memory elements, which may be simple flip-flops or more sophisticated blocks of memory. Many FPGAs can be reprogrammed
Field-programmable_gate_array
(IEEE) in 2013 for his development of three-dimensional multichip modules and flip chip interconnects. "2013 elevated fellow" (PDF). IEEE Fellows Directory
Wei_Hu_Koh
2019 Asus flagship smartphone with flip camera
processor, and upgraded cameras than the ZenFone 5Z. The ZenFone 6's flip-up camera module doubles as a front-facing camera. It is the first mobile device
Asus_ZenFone_6
Step in the design cycle of devices
and then proceeds to design each module. These modules are linked together in the main module called the TOP LEVEL module. This kind of partitioning is commonly
Physical_design_(electronics)
Processor family
models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range is the last flagship range of Intel desktop processors
Intel_Core_2
Bit-vector representation where only one bit can be set at a time
have 15 flip-flops chained in series with the Q output of each flip-flop connected to the D input of the next and the D input of the first flip-flop connected
One-hot
October 2021. Retrieved 22 October 2021. "Ultra-Wideband (UWB) IC and modules | Qorvo". www.qorvo.com. Archived from the original on 25 May 2022. Retrieved
List of UWB-enabled mobile devices
List_of_UWB-enabled_mobile_devices
Data storage device
metal–oxide–semiconductor (MOS) memory cells on a silicon integrated circuit memory chip. There are numerous different types using different semiconductor technologies
Semiconductor_memory
Part of computer memory
transistors (MOSFETs) as flip-flops, along with MOS capacitors for certain types of RAM. The SRAM (static RAM) memory cell is a type of flip-flop circuit, typically
Memory_cell_(computing)
It comes with a 64 MB Reduced Size MMC. The main CPU is an ARM compatible chip (ARM4T architecture) running at 123 MHz. The 7710's 640x320 screen was a
List_of_Nokia_products
Digital circuit design abstraction
model gives a correct estimate for the total power consumption by the chip, the module wise power distribution is fairly inaccurate. The chosen activity factor
Register-transfer_level
systems on chips (SoC) made by Qualcomm for use in smartphones, tablets, laptops and 2-in-1 PCs. List of Qualcomm Snapdragon systems on chips "Snapdragon
List of devices using Qualcomm Snapdragon systems on chips
List_of_devices_using_Qualcomm_Snapdragon_systems_on_chips
Modular computer component
components. Examples: IBM SMS cards DEC System Building Blocks cards DEC Flip-Chip cards Circuit boards containing monolithic ICs and/or hybrid ICs, such
Field-replaceable_unit
Series of video cards
manufacturing of the core was the use of the flip-chip packaging, a technology not used previously on video cards. Flip chip packaging allows far better cooling
Radeon_R300_series
Either of two concepts in computer engineering
regulator module to provide the even lower power supply voltages required by many CPUs. Because of the incompatibility of the CD4000 series of chips with the
Logic_family
Electronic signal to synchronize circuits
of digital circuit, the clock signal is applied to all storage devices, flip-flops and latches, and causes them all to change state simultaneously, preventing
Clock_signal
Temperature regulation of diodes
of the LED dramatically improves the LED’s lifetime. Flip chip – concept is similar to flip-chip in package configuration widely used in the silicon integrated
Thermal management of high-power LEDs
Thermal_management_of_high-power_LEDs
American multinational semiconductor company
is focused on high performance per watt. Magny Cours is an MCM (multi-chip module) with two hexa-core "Istanbul" Opteron parts. This will use a new socket
AMD
2021 Asus flagship smartphone
The Asus ZenFone 8 (known as Asus 8z in India) and Asus ZenFone 8 Flip are Android-based smartphones designed, developed and manufactured by Asus as part
Asus_ZenFone_8
Hardware description language
functions like this are part of a larger behavioral module, instead of having a separate module for something so simple. In addition, use of elements
VHDL
Set of chipsets by ATI
Northbridge design 55 nm CMOS fabrication process manufactured by TSMC 528-pin Flip Chip Ball Grid Array (FCBGA) package Performance hybrid multi-graphics segment
AMD_700_chipset_series
Digital motion picture camera system by Arri
(MVF-2) with a larger flip-out monitor and power outputs for camera accessories. The camera also features a new Codex recording module, which accepts 1TB
Arri_Alexa
Robotic machine
This type of equipment is sometimes used to package microchips using the flip chip method. The origins of pick-and-place automation can be traced back to
Pick-and-place_machine
Mobile phone
model is powered by the Kirin 9010S 5G chip, while the remaining variants utilise the HiSilicon Kirin 9020 5G chip. In China, the smartphone series runs
Huawei_Pura_80
Series of video cards
manufacturing of the core was the use of the flip-chip packaging, a technology not used previously on video cards. Flip chip packaging allows far better cooling
Radeon_9000_series
Reprogrammable computer hardware technology
adaptive logic module (ALM), a logic element (LE), slice, etc.). A typical cell consists of a 4-input LUT, a full adder (FA), and a D-type flip-flop (DFF)
Logic_block
CPU socket for AMD processors with Zen and Excavator architectures
Excavator microarchitecture) Supports PCIe 3.0 and PCIe 4.0 Supports up to 4 modules of DDR4 RAM in dual-channel configuration The AM4 socket specifies the
Socket_AM4
Computer security exploit
predefined chip-specific maximum activate count (MAC) and maximum activate window (tMAW) values, and refreshes these rows to prevent bit flips. The MAC
Row_hammer
Adhesive that is commonly used in liquid crystal display manufacturing
Archived 23 June 2015 at the Wayback Machine Kyocera "Pastes for Flip Chip Assembly use, TAP/TNP Series" (PDF). 28 September 2005. Three Bond http://www
Anisotropic_conductive_film
Class of digital circuits
manufacturer, IBM, built its own flip chip integrated circuits with TTL; these chips were mounted on ceramic multi-chip modules. TTL devices consume substantially
Transistor–transistor_logic
Computers using chaotic systems
Retrieved October 15, 2012. "Method and apparatus for a chaotic computing module," W. Ditto, S. Sinha and K. Murali, US Patent Number 07096347 (August 22
Chaos_computing
Number of transistors in a device
V-NAND flash memory chip, with 5.3 trillion floating-gate MOSFETs (3 bits per transistor). The highest transistor count in a single chip processor as of 2020[update]
Transistor_count
performance chipsets. The 82850 series was supplied in the FC- BGA package (Flip Chip Ball Grid Array Package) manufactured according to the 0.13 μm process
Intel_850
Type of integrated circuit
(ASICs) using a prefabricated chip with components that are later interconnected into logic devices (e.g., NAND gates, flip-flops, etc.) according to custom
Gate_array
Form of non-volatile memory used in computers and other electronic devices
physical features or structures that will be removed, or added in the ROM chips, and the presence or absence of these features will represent either a 1
Read-only_memory
MOSFET technology node
started their production of "10 nm-class" chips in 2013 for their multi-level cell (MLC) flash memory chips, followed by their SoCs using their 10 nm
10_nm_process
American academic
Questad, D.L.; Sammakia, B.G. (December 1999). "Adhesion issues in flip-chip on organic modules". IEEE Transactions on Components and Packaging Technologies
Bahgat_G._Sammakia
Peanuts comic strip character
1990s comic strips, he is obsessed with cookies, particularly the chocolate-chip variety. This, and other instances in which he indulges in large chocolate-based
Snoopy
use a chiplet architecture, which means that the processor is a multi-chip module. In June 2023, Intel unveiled new branding for the Meteor Lake processors
List_of_Intel_processors
Component that stores information
memory in the 1960s. The first semiconductor memory was implemented as a flip-flop circuit in the early 1960s using bipolar transistors. Semiconductor
Computer_memory
GPU for the PlayStation 3
further weakening the BGA connections. The RSX was packaged using a flip-chip process. The underfill material used in early versions had a relatively
RSX_Reality_Synthesizer
FLIP CHIP-MODULE
FLIP CHIP-MODULE
Girl/Female
Gujarati, Indian, Sanskrit, Sindhi
Heart
Boy/Male
Greek
Lover of horses.
Boy/Male
American, Australian, British, Christian, English, German, Jamaican
Chipping Sparrow; Man; Strong Man; A Freeman
Female
Japanese
(æµ) Japanese name CHIE means "wisdom."
Surname or Lastname
English
English : variant spelling of Chinn.Chinese : variant of Jin 1.Chinese : Cantonese variant of Qian.Chinese : variant of Qin 1.Chinese : variant of Qin 2.Chinese : variant of Jin 2.Chinese : variant of Jin 3.Korean : there are four Chinese characters for the surname Chin, representing five clans. At least three of the clans have origins in China; most of them migrated to Korea during the Kory{ou} period (ad 918–1392).
Boy/Male
Gypsy
Earth.
Female
African
gift.
Boy/Male
Indian
Long of time
Female
Thai/Siamese
Thai name NGAM-CHIT means "good heart."
Boy/Male
Indian
Tauhin
Boy/Male
Australian, British, Czechoslovakian, Danish, Dutch, English, French, German, Greek, Polish, Russian, Spanish, Swedish
Russian Form of Philip; Horse Lover; Friend of Horses
Boy/Male
Vietnamese
Bird.
Boy/Male
Muslim
Long of time
Boy/Male
English American
Man (from the Old English 'ceorl'). Famous Bearers: American movie star Charles Bronson;...
Boy/Male
British, English
Peddler; Merchant; Diminutive of Chapman
Female
Vietnamese
Vietnamese name CHI means "tree branch."
Boy/Male
English
Peddler; merchant.
Male
Serbian
(Филип) Serbian form of Greek Philippos, FILIP means "lover of horses."
Boy/Male
Gaelic Irish
Son of the red haired one.
Boy/Male
Russian Swedish
loves horses'.
FLIP CHIP-MODULE
FLIP CHIP-MODULE
Girl/Female
Indian, Malayalam
Powerful
Male
English
Middle English form of French Moisé, MOISE means "drawn out."
Boy/Male
Indian, Sanskrit
One who Provides Safety
Boy/Male
African, American, Christian, Danish, Finnish, French, German, Indian, Swedish
Ever Powerful; Ever Ruler
Boy/Male
Gujarati, Hindu, Indian, Kannada, Malayalam, Marathi, Sanskrit, Telugu
Bhishma
Boy/Male
Latin
A guardian spirit.
Boy/Male
Hindu, Indian, Marathi
Treasure of Nobility
Girl/Female
Muslim/Islamic
Star
Girl/Female
Hindu, Indian, Kannada, Malayalam, Marathi, Sanskrit, Telugu
Golden-eyed; Fairy Face; Intelligent; Kind
Girl/Female
Hindu
Origin, Name of river
FLIP CHIP-MODULE
FLIP CHIP-MODULE
FLIP CHIP-MODULE
FLIP CHIP-MODULE
FLIP CHIP-MODULE
p. pr. & vb. n.
of Clip
v. i.
To move swiftly; -- usually with indefinite it.
n.
A toe clip. See Clip, n. (Far.).
v. t.
To embrace, hence; to encompass.
n.
An embrace.
v. t.
To clip; to trim.
v. i.
To clip with scissors.
v. t.
To clip; to mow.
n.
A projecting flange on the upper edge of a horseshoe, turned up so as to embrace the lower part of the hoof; -- called also toe clip and beak.
n.
To beat with a flap; to strike.
n.
An embracing strap for holding parts together; the iron strap, with loop, at the ends of a whiffletree.
v. t.
To bet, as with chips in the game of poker.
n.
A blow or stroke with the hand; as, he hit him a clip.
n.
A clasp or holder for letters, papers, etc.
imp. & p. p.
of Clip
n.
A cutting; a shearing.
v. t.
To curtail; to cut short.
v. t.
To cut off; as with shears or scissors; as, to clip the hair; to clip coin.
n.
The product of a single shearing of sheep; a season's crop of wool.
v. t.
To toss or fillip; as, to flip up a cent.