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Type of integrated circuit packaging
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular
Pin_grid_array
Type of surface-mount packaging for integrated circuits
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a
Land_grid_array
Surface-mount packaging that uses an array of solder balls
BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation
Ball_grid_array
typically 0.5 mm Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather
List of electronic component packaging types
List_of_electronic_component_packaging_types
Processor socket made by Intel
last Intel desktop socket to use a pin grid array (PGA) interface. All later Intel desktop sockets use a land grid array (LGA) interface. The traditional
Socket_478
CPU socket for old AMD CPUs
same name used for the PPC G3 processors) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird
Socket_A
Socket for Intel microprocessors
Socket rPGA 947 has one extra pin hole, other than that it is identical to socket G3. It is the last pin grid array socket for Intel's mobile processors
Intel_Socket_G3
Type of electronic component package
respectively) Pin grid array (PGA) packages may be considered to have evolved from the DIP. PGAs with the same 0.1 inches (2.54 mm) pin centers as most
Dual_in-line_package
Final stage of semiconductor device fabrication
first area array package was a ceramic pin grid array package. Not long after, the plastic ball grid array (BGA), another type of area array package, became
Integrated_circuit_packaging
Intel CPU socket
169-pin pin grid array (PGA) socket and the first with an official designation. Socket 1 was intended as a 486 upgrade socket, and added one extra pin to
Socket_1
Circuit board-microprocessor connection
chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include pin grid array (PGA) or land grid array (LGA). These designs
CPU_socket
Disambiguation article
ICL Integrated circuit packages: Ball grid array pin grid array land grid array Processor array Programmable Array Logic (PAL), a systematic way to implement
Array
Microprocessor socket
Pentium OverDrive processors. Socket 2 was a 238-pin zero insertion force (ZIF) 19×19 pin grid array (PGA) socket suitable for the 5-volt, 25 to 66 MHz
Socket_2
Type of integrated circuit
gate arrays to drive and receive the system bus. A custom 419-pin pin grid array (PGA) package was developed to house all bus interface gate arrays. ..
Gate_array
CPU socket
Socket 4. Consisting of 320 pins, this was the first socket to use a staggered pin grid array (SPGA), which allowed the chip's pins to be spaced closer together
Socket_5
Series of CPU sockets
rearranged the pin layout. Socket 3 is compatible with 168-pin socket CPUs. Socket 3 was a 237-pin zero insertion force (ZIF) 19×19 pin grid array (PGA) socket
Socket_3
L2 cache (integrated) 242-pin Slot-1 SECC2 (Single Edge Contact cartridge 2) processor package, 370-pin FC-PGA (flip-chip pin grid array) package System Bus
List_of_Intel_processors
CPU socket for AMD Ryzen processors with Zen architecture
Ridge (derived from Excavator) powered Athlon X4 and some A-Series, a pin grid array (PGA) socket that they promised to support until 2020. At CES 2022,
Socket_AM5
American technology company
renowned for inventing the first commercially viable field-programmable gate array (FPGA). It also pioneered the first fabless manufacturing model. Xilinx
Xilinx
CPU socket from Intel
P6100, P6200, P6300 Intel Celeron P4500, P4600 Pins arranged in a 36 × 35 grid array 18 × 15 size grid removed from the center Utilization of cam actuated
Socket_G1
Brand of microprocessors by AMD
June 4, 2000. This version of the Athlon was available in a traditional pin-grid array (PGA) format that plugged into a socket ("Socket A") on the motherboard
Athlon
MIPS microprocessor
in a 179-pin ceramic pin grid array (CPGA). The R4000SC and R4000MC are packaged in a 447-pin ceramic staggered pin grid array (SPGA). The pin out of the
R4000
Topics referred to by the same term
difference in size between right and left tires Staggered Pin Grid Array, a style of arranging pins on an integrated circuit package Staggered spinup, a method
Staggered
CPU socket for old AMD CPUs
incompatible with 939 motherboards and vice versa, and although it has 940 pins, it is incompatible with Socket 940. Socket AM2 supports DDR2 SDRAM memory
Socket_AM2
American computer company
the 386 Translator. This was a module that could be plugged into the pin-grid array socket reserved for the 80286 microprocessor on the motherboard of IBM's
American Computer and Peripheral
American_Computer_and_Peripheral
Intel CPU socket
with Socket 478. Socket P is also known as a 478-pin Micro-FCPGA or μFCPGA-478. On the plastic grid is printed as mPGA478MN. List of Intel microprocessors
Socket_P
CPU socket for Intel mobile processors
QM77 chipset. Pins arranged in a 35 × 36 grid array (it is incompatible with G1 socket due to different placing of one pin) 18 × 15 size grid removed from
Socket_G2
CPU socket for laptop AMD CPUs
722-pin package Socket AM1 (FS1b), it is not clear whether these desktop CPUs will be compatible with Socket FS1 or vice versa. It is the last pin grid array
Socket_FS1
Sixth-generation x86 microprocessor by Intel
The MCM has 387 pins, of which approximately half are arranged in a pin grid array (PGA) and half in an interstitial pin grid array (IPGA). The packaging
Pentium_Pro
Processor family
Cores 1, 2, or 4 Packages Flip-chip land grid array (FC-LGA) Micro pin grid array (mPGA) Flip-chip ball grid array (FC-BGA) Sockets Socket T (LGA 775) Socket
Intel_Core_2
Surface mount integrated circuit package with "gull wing" pins extending from all sides
process and alignment of parts during assembly. The later pin grid array (PGA) and ball grid array (BGA) packages, by allowing connections to be made over
Quad_flat_package
CPU socket
on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins. Socket 370 was replaced by Socket 423 in 2000. Socket 370
Socket_370
metal–oxide–semiconductor (CMOS) process. The PA-7100 is packaged in a 504-pin ceramic pin grid array that has a copper-tungsten heat spreader. An improved PA-7100
PA-7100
CPU socket for old AMD CPUs
controller The AM3 socket has 941 pins instead of AM2+’s 940. The keying is designed in a way so that an AM3 processor (938 pins) can mechanically fit into an
Socket_AM2+
Technique for driving a multiplexed display
one calculator digit, not the complete array of digits. With traditional multiplexing N {\displaystyle N} I/O pins can drive a maximum of ( N 2 ) 2 = N
Charlieplexing
603 contacts arrayed in a grid about the center of the socket, each contact has a 1.27mm pitch with regular pin array, to mate with a 603-pin processor package
Socket_603
Microprocessor developed by Hewlett-Packard
three-level metal CMOS26B process. The PA-7100LC is packaged in a 432-pin ceramic pin grid array. The PA-7300LC was a further development of the PA-7100LC. It
PA-7100LC
Electronic circuit formed on a small, flat piece of semiconductor material
In the 1980s, the pin count of VLSI circuits exceeded the practical limit of DIP packaging, leading to the adoption of pin grid array (PGA) and leadless
Integrated_circuit
Topics referred to by the same term
Professional Graphics Array, other names for Professional Graphics Controller, an IBM XT graphics card intended for the CAD market Pin grid array, a type of packaging
PGA
(ball grid array) format. It replaces Socket 615 (μPGA1), which was used in Pentium II and early Celeron mobile processors. This socket is a 495 pin CPU
Socket_495
32-bit microprocessor by Motorola
higher total pin count. By the early 1980s, similar limitations on all modern CPU designs led to the introduction of the pin grid array that replaced
Motorola_68020
Japanese manga series
name of that river was used as a codename for the 866 MHz Flip Chip Pin Grid Array (FCPGA) Pentium III (P3-850) microprocessor, which was released by Intel
Yu-Gi-Oh!_R
604-pin microprocessor socket
pins, it only has 603 electrical contacts, the last being a dummy pin. Each contact has a 1.27mm pitch with regular pin array, to mate with a 604-pin
Socket_604
PFS—Perfect forward secrecy PG—Peripheral Gateway PGA—Pin Grid Array PGA—Programmable Gate Array PGO—Profile-Guided Optimization PGP—Pretty Good Privacy
List of computing and IT abbreviations
List_of_computing_and_IT_abbreviations
Family of Intel microprocessors
million Dothan: 140 million Cores 1 Packages Micro pin grid array (mPGA) High performance ball grid array (H-PBGA) Sockets Socket 479 H-PBGA479 Cache L1 cache
Pentium_M
Minicomputer by Digital Equipment Corporation
transistors on a 0.595 by 0.586 inch die packaged in a custom 339-pin ceramic pin grid array (CPGA). The system supported a maximum of 1 GB of memory. Computergram
VAX_6000
Microprocessor model
was produced in a 68-pin package, including PLCC (plastic leaded chip carrier), LCC (leadless chip carrier) and PGA (pin grid array) packages. The performance
Intel_80286
Type of microprocessor
was introduced in mid-1991 at 20 MHz, one core with 8kb of cache in a pin grid array (PGA) package. There were low-power version of 16, 20, and 25 MHz Intel486
I486SX
Interface between an electronic test system and a semiconductor wafer
A tektronix pin-grid array probe card
Probe_card
RISC-based microprocessor design
32-bit ISA standard. It was originally packaged in a 348 lead ceramic pin grid array and later supplied as a bare die. The i960 MX supports object-oriented
Intel_i960
CPU socket
479 has 479 pin holes. Pentium M processors in PGA package have 479 pins that plug into this zero insertion force socket. Only 478 pins are electrically
Socket_479
64-bit microprocessor developed in 1996
was packaged in a 272-ball plastic ball grid array (BGA) or 223-pin ceramic pin grid array (PGA). It was not pin-compatible with any previous MIPS microprocessor
R5000
Microprocessor designed by MIPS Technologies, Inc.
interconnect. It was packaged in a 179-pin ceramic pin grid array that was compatible with the R4x00PC and R4600, or a 208-pin plastic quad flat pack (PQFP).
R4200
MIPS microprocessor
was packaged in a 527-pin ceramic pin grid array (CPGA); and that vendors also investigated the possibility of using a 339-pin multi-chip module (MCM)
R10000
32 bit microprocessor developed by RSRE
CMOS and silicon-on-sapphire technologies, being packaged as a 120-pin grid array product. Architecturally, VIPER is a 32-bit processor supporting 20-bit
VIPER_microprocessor
wiring. It is packaged in a 36 mm by 36 mm ceramic pin grid array module which had 201 signal pins. It required a 3.6 volt power supply and consumed 4
RISC_Single_Chip
Security-related instruction code processor extension
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Software_Guard_Extensions
Multi-chip CPU by IBM implementing the POWER instruction set architecture
interconnect. The chips are packaged in ceramic pin grid array (CPGA) packages that can have up to 300 pins and dissipate a maximum of 4 W of heat each.
POWER1
Topics referred to by the same term
CPGA may stand for: Ceramic pin grid array, a kind of a package for integrated circuits Cornish Pilot Gig Association This disambiguation page lists articles
CPGA
RISC microprocessor
of interconnect. The Alpha 21264 was packaged in a 587-pin ceramic interstitial pin grid array (IPGA). Alpha Processor, Inc. later sold the Alpha 21264
Alpha_21264
Electrical connection consisting of a length of wire or a metal pad
through-hole electronic components are also often called pins;[citation needed] in ball grid array packages, they are in form of small spheres, and are therefore
Lead_(electronics)
Problems with central processing unit design
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Hazard (computer architecture)
Hazard_(computer_architecture)
Microprocessor
0–16.78 MHz or 0–25.16 MHz Operation 144-Pin Ceramic Quad Flat Pack (CQFP) or 145-Pin Plastic Pin Grid Array (PGA) Available in 3.3 and 5V The MC68340
MC68340
Microprocessor
56 W at 333 MHz. The Alpha 21164 is packaged in a 499-pin ceramic interstitial pin grid array (IPGA) measuring 57.40 by 57.40 mm. The package had a heat
Alpha_21164
Digital circuit that produces sums from inputs
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Adder_(electronics)
is 9.02 × 9.02 mm large (81.36 mm2). Both are packaged in 135-pin ceramic pin grid arrays. A CMOS version of the ROMP and Rosetta (called ROMP-C and Rosetta-C)
IBM_ROMP
Combinational digital circuit
general-purpose CPUs, the ALU typically operates in conjunction with a register file (array of processor registers) or accumulator register, which the ALU frequently
Arithmetic_logic_unit
Standardized computer chip nomenclature
letter Э (E) here indicates an integrated circuit intended for export with a pin spacing of 2.54mm (1/10") or 1.27mm (1/20"). If this element is empty then
Soviet integrated circuit designation
Soviet_integrated_circuit_designation
CMOS microprocessor by Digital Equipment Corporation
three layers of aluminium interconnect. The NVAX is packaged in a 339-pin pin grid array. The NVAX was offered at a variety of clock speeds, 83.3 MHz (12 ns)
NVAX
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Redundant binary representation
Redundant_binary_representation
Method of CPU communication
address space from general memory, either accomplished by an extra "I/O" pin on the CPU's physical interface, or an entire bus dedicated to I/O. Because
Memory-mapped I/O and port-mapped I/O
Memory-mapped_I/O_and_port-mapped_I/O
Intel CPU interface
is pin-compatible with the older mobile Socket 479 (mPGA478A) for Pentium III-M processors but is not electrically compatible. Socket M is not pin-compatible
Socket_M
Computer hardware technology
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Trusted_Execution_Technology
Hardware cache of a central processing unit
processors along with a shared 64 MiB L4 cache on a multi-chip module that was pin compatible with a Madison processor. Intel's Xeon MP product codenamed "Tulsa"
CPU_cache
1987 IBM desktop computer
features an Intel 80286 microprocessor clocked at 10 MHz. Instead of the pin-grid-array version of the 80286 as used in earlier IBM machines, the company opted
IBM_PS/2_Model_30
Replaceable RAM form factor
Memory Module (CAMM) is a memory module form factor which uses a land grid array (LGA). CAMM can refer to both the general form and an early version developed
CAMM_(memory_module)
Series of 32 bit CISC microprocessors
1979 68000 64-pin dual in-line package (DIP), 64-pin SPDIP, 68-pin PLCC, 68-pin CLCC, 68-pin pin grid array (PGA), 64-pin QFP, 68-pin QFP 8–50 24 - -
Motorola_68000_series
Type of digital adder
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Carry-save_adder
layer – Pickup – PID controller – Piezoelectricity – Pin grid array – Pirate radio – Planar array – Planck constant – Plesiochronous Digital Hierarchy
Index_of_electronics_articles
Microprocessor
The 21064 is packaged in a 431-pin alumina-ceramic pin grid array (PGA) measuring 61.72 mm by 61.72 mm. Of the 431 pins, 291 were for signals and 140 were
Alpha_21064
Circuit that performs subtraction
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Subtractor
Computer component
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Translation_lookaside_buffer
design. It was packaged in a ceramic multi-chip module (MCM) with a pin grid array (PGA). The hyperSPARC used the Cypress SparcSet chipset which was introduced
HyperSPARC
Defunct American computer company
connector was a pin grid array design, in which each pin is split into four and arranged into quadrant occupying the footprint of the average pin on a normal
Panda_Project
vision-based CMMs 1994: VIEW 830 – A laser-based, 3D scanner system for PGA (Pin grid array) package inspection 1995: VIEW 8100 – A laser-based, 3D scanner system
VIEW_Engineering
Topics referred to by the same term
may refer to : Micro-PGA1, the predecessor of the Intel's Micro-PGA2 pin grid array package for their Pentium III Prostaglandin A1, a form of prostaglandin
PGA1
CPU socket for Intel desktop processors
grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on
LGA_1200
Microprocessor chipset
metal–oxide–semiconductor (CMOS) process. Both are packaged in 591-pin ceramic pin grid array (CPGA) packages. Both chips used a 3.3 V power supply, and the
R8000
Late vacuum tube design designed to compete with transistors
are: Pin 2 - Plate/anode Pin 4 - Grid Pin 8 - Cathode Pins 10 and 12 - Heater Base 12AS is the tetrode layout. The connections are: Pin 2 - Grid 2 Pin 4
Nuvistor
Family of superminicomputers by Digital Equipment Corporation
3 μm MOSAIC bipolar process. They are packaged in 68-pin leadless chip carriers or pin grid arrays and are mounted onto the printed circuit board in sockets
VAX_8000
Device that controls current between electrodes
with the suppressor grid wired internally to the cathode (e.g. EL84/6BQ5) and those with the suppressor grid wired to a separate pin for user access (e
Vacuum_tube
(RAM) Up to 8 GB Up to DDR3-1333 with 21 GB/s bandwidth Package Reduced pin grid array (rPGA) Socket Socket G1 (rPGA988) Cache L1 cache 256 KB (64 KB per core
Clarksfield_(microprocessor)
2021 Intel CPU socket
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors based on Alder Lake and
LGA_1700
Electrical socket
slots into which the pins drop allowing devices of differing widths to be inserted. ZIF sockets can be used for ball grid array chips, particularly during
Zero_insertion_force
Register in a computer's CPU
chronology Processor design Digital electronics Hardware security module Semiconductor device fabrication Tick–tock model Pin grid array Chip carrier
Memory_buffer_register
Array of logic gates that are reprogrammable
referred to as programmable logic devices (PLDs). They consist of a grid-connected array of programmable logic blocks that can be configured "in the field"
Field-programmable_gate_array
Intel CPU socket
1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge
LGA_1155
1995 microprocessor
solder bumps. The MCM has 565 pins, of which 286 are signal pins and 218 are power pins, organized as a pin grid array (PGA). The MCM has wide buses which
HAL_SPARC64
Computer display standard and resolution
Video Graphics Array (VGA) is a video display controller and accompanying de facto graphics standard, first introduced with the IBM PS/2 line of computers
Video_Graphics_Array
Series of server computers
299-position pin grid array (PGA) package. The memory module is the same size as the CPU module and connects to the backplane via two 129-pin and four 24-pin connectors
DEC_4000_AXP
PIN GRID-ARRAY
PIN GRID-ARRAY
Surname or Lastname
English and German
English and German : metonymic occupational name for a maker of pins or pegs, from Middle English pin, Middle Low German pin(ne) ‘pin’, ‘peg’. In some cases the German name was an metonymic occupational name for a shoemaker.English (Devon) : from Middle English pinne ‘hill’ (Old English penn), a topographic name or a habitational name from a place named with this word, e.g. Pinn, Pinn Court Farm, or Pin Hill Farm, all in Devon.
Girl/Female
Norse
A wife of Odin.
Surname or Lastname
English
English : unexplained.Chinese : see Pan.
Surname or Lastname
English and French
English and French : from Middle English pine, Old French pin, a topographic name for someone who lived by a conspicuous pine tree or in a pine forest. It may also be a Norman habitational name from any of various places named with this word, such as Le Pin in Calvados; in other cases it may originally have been a nickname for a tall man, one thought to resemble a pine tree.German : variant spelling of Peine.
Boy/Male
British, Dutch, English, Greek
From the Pit
Boy/Male
Welsh
Legendary son of Eri.
Boy/Male
Indian
Need, Strong grip
Male
German
Abbreviated form of German Ägidius, ÄGID means "kid; young goat" or "shield of goatskin."
Female
Norse
Old Norse myth name of a frost giantess, GRID means "peace."
Boy/Male
Norse
A man freed by Skallagrim.
Boy/Male
Muslim
Need, Strong grip
Male
French
Old French name, possibly derived from the word pepin/pipin, PÉPIN means "seed of a fruit."
Girl/Female
Celtic, French, German, Irish
Strong; Protective
Girl/Female
Celtic Irish
Strong.
Boy/Male
Norse
Son of Njal.
Male
Spanish
 Italian and Spanish name derived from the word pino, PINO means "pine tree." Compare with another form of Pino.
Female
Irish
Irish derived from Gaelic brÃgh, BRÃGHID means "force, strength." In Celtic mythology, this is the name of a goddess, the daughter of Dagda, one of the Tuatha Dé Danann. She is also known by the Gaulish name Brigindos, meaning "exalted one."
Male
English
Short form of English Gideon, GID means "cutter down; hewer," i.e. "mighty warrior."
Surname or Lastname
Dutch
Dutch : nickname for a dour and forbidding person, from Middle Dutch grim, grem ‘stern’, ‘severe’.English : nickname with the same meaning as 1, from Old English grim ‘fierce’, ‘grim’.Respelling of German Grimm.
Boy/Male
Norse Vietnamese
Son of Grim.
PIN GRID-ARRAY
PIN GRID-ARRAY
Girl/Female
Arabic, Indian, Muslim, Tamil
Mother of Jesus Christ; Beloved; Purity
Male
Czechoslovakian
, downy-cheeked, or, soft-haired.
Boy/Male
Muslim
Pennyroyal
Surname or Lastname
English
English : variant spelling of Wilmore.
Boy/Male
Irish
Beloved.
Boy/Male
Tamil
Sukarman | ஸà¯à®•à®°à¯à®®à®¨
Reciter of samhitas
Boy/Male
Hindu, Indian
Name of Hindu Goddess Durga
Boy/Male
Hindu
Male
Gaelic
Variant spelling of Gaelic Cainnech, CAINNEACH means "comely; finely made."Â
Girl/Female
Muslim
Following, Mystic
PIN GRID-ARRAY
PIN GRID-ARRAY
PIN GRID-ARRAY
PIN GRID-ARRAY
PIN GRID-ARRAY
imp. & p. p.
of Rid
v. t.
A peculiar mode of clasping the hand, by which members of a secret association recognize or greet, one another; as, a masonic grip.
p. pr. &, vb. n.
of Grit
v. t.
To grind; to rub harshly together; to grate; as, to grit the teeth.
n.
Structure, as adapted to grind or sharpen; as, a hone of good grit.
n.
A hard, coarse-grained siliceous sandstone; as, millstone grit; -- called also gritrock and gritstone. The name is also applied to a finer sharp-grained sandstone; as, grindstone grit.
v. i.
To gride. See Gride.
v. t.
To prepare; to make ready; to equip; as, to gird one's self for a contest.
p. pr. & vb. n.
of Grin
imp. & p. p.
of Grind
v. i.
To give forth a grating sound, as sand under the feet; to grate; to grind.
n.
An ornament, as a brooch or badge, fastened to the clothing by a pin; as, a Masonic pin.
n.
To fasten with, or as with, a pin; to join; as, to pin a garment; to pin boards together.
v. t.
That by which anything is grasped; a handle or gripe; as, the grip of a sword.
p. pr. & vb. n.
of Grind
v. t.
To give a grip to; to grasp; to gripe.
n.
A rolling-pin.
n.
That which resembles a pin in its form or use
imp. & p. p.
of Grit
a. & n.
from Grind.