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Tiny integrated circuit with a well-defined function
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on
Chiplet
Universal Chiplet Interconnect express
Universal Chiplet Interconnect Express (UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets. It is co-developed
UCIe
GPU microarchitecture by AMD
50% with RDNA 3 and that the upcoming architecture would be built using chiplet packaging on a 5 nm process. A sneak preview for RDNA 3 was included towards
RDNA_3
Aims to overcome limitations of semiconductors
memory in a single package, die stacking, wafer bonding/stacking, several chiplets or dies in a package, combinations of these techniques, and others. 2.5D
Advanced packaging (semiconductors)
Advanced_packaging_(semiconductors)
2019 AMD 7-nanometer processor microarchitecture
showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. AMD CEO Lisa Su also said to expect more
Zen_2
Singaporean semiconductor packaging and assembly company
Weili Dai, the company provides backend infrastructure needed for enabling chiplet adoption. Considered as a pioneer in the field, Silicon Box functions like
Silicon_Box
AMD brand for microprocessors
Haswell released in 2014, a shift to an multi-chip module (MCM) style chiplet package design, and a further shrink to Taiwan Semiconductor Manufacturing
Ryzen
Series of video cards by AMD
reference cooler and the GPU chiplets. HardwareLuxx instead considered that the direct die cooling used for the Navi 31 chiplets could be difficult due to
Radeon_RX_7000_series
Intel microprocessor, released in 2023
the first generation of Intel server and workstation processors to use a chiplet design. Sapphire Rapids is part of the Eagle Stream server platform. In
Sapphire_Rapids
American system-on-chip technology company
hardware security assurance that is used to create semiconductor chip and chiplet designs for a variety of devices, particularly in automotive electronics
Arteris
2020 AMD 7-nanometer processor microarchitecture
2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips
Zen_3
Electronic circuit formed on a small, flat piece of semiconductor material
Semiconductor Engineering. "Chiplet". WikiChip. 28 February 2021. "To Keep Pace With Moore's Law, Chipmakers Turn to 'Chiplets'". Wired. 11 June 2018. Schodt
Integrated_circuit
2024 AMD 4-nanometer processor microarchitecture
technologies. Strix Halo represented a major departure of previous multi-chiplet mobile processors. Strix Halo's CCD is actually not the same type of CCD
Zen_5
Intel microprocessor series released in 2023
2023. It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. Meteor
Meteor_Lake
Microarchitecture family by AMD
connect up to eight 8-core chiplets, while the IO die for Matisse is able to connect up to two 8-core chiplets. These chiplets are linked by AMD's own second
Zen_(microarchitecture)
Brand of data center GPUs by AMD
and InFO (integrated fan-out), to combine multiple chiplets on a single interposer. The chiplets are interconnected by AMD’s Infinity Fabric, which enables
AMD_Instinct
AMD brand of server microprocessors
Zen 2 microarchitecture. The processors feature up to eight 7 nm-based "chiplet" processors with a 14 nm-based IO chip providing 128 PCIe 4.0 lanes in
Epyc
Advanced packaging technique
already take advantage of these LEGO-style chiplets; some experts predict the emergence of an industry-wide chiplet ecosystem. Interposers can be larger than
2.5D_integrated_circuit
American semiconductor and AI company
late 2025, the company joined the Arm Total Design ecosystem to support chiplet-based AI infrastructure designs. In February 2026, the company announced
Astera_Labs
architecture based on 7 nm process, first architecture designed around chiplet technology. AMD Zen 3 Family 19h – third generation Zen architecture in
List of AMD CPU microarchitectures
List_of_AMD_CPU_microarchitectures
GPU microarchitecture and accompanying instruction set architecture
CPUs, AMD CEO Lisa Su teased RDNA 3 and revealed that it would utilize chiplets built on TSMC's N5 node. On September 19, 2022, Sam Naffziger, the current
RDNA_(microarchitecture)
Taiwanese flash memory manufacturer
make secure embedded flash products. In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium. List of semiconductor fabrication plants
Winbond
American supercomputer
and GPU chiplets, which runs at 5.2 GHz and delivers an aggregate 5.3 TB/sec of aggregate bandwidth into and out of the CPU and GPU chiplets." El Capitan
El_Capitan_(supercomputer)
Brand of microprocessors
Branding and Model Cores (threads) Clock rate (GHz) L3 cache (total) TDP Chiplets Core config Release date Launch price Base PBO 1–4 (≥5) XFR 1–2 Ryzen Threadripper
Threadripper
Line of CPUs produced by Intel
2023. It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. Tim
Intel_Core
Electronic assembly containing multiple integrated circuits that behaves as a unit
Blocks" ("IP Blocks"), of a component in a computer. These are known as chiplets. An example of this are the processing ICs and I/O IC of AMD's Zen 2-based
Multi-chip_module
2014 family of multi-core microprocessors by IBM
eDRAM cache per chiplet shareable among all chiplets. Thus, a 6-chiplet processor would have 48 MB of L3 eDRAM cache, while a 12-chiplet processor would
POWER8
American multinational computational software company
software, hardware and intellectual property (IP) used to design chips, chiplet-style products, and printed circuit boards, while also selling hardware
Cadence_Design_Systems
move to a modular, chiplet-based approach. Towards the end of 2017, Naffziger began to lead the AMD graphics team in bringing a chiplet architecture to graphics
Sam_Naffziger
Indonesian-born American businessman (1961–2024)
and manufacture of chiplet packaging. The venture-backed company opened a $2 billion facility in Tampines in 2023 to produce chiplets for their customers
Sehat_Sutardja
Open standard processor interconnection for data centers
of latency. Coherent Accelerator Processor Interface (CAPI) Universal Chiplet Interconnect express (UCIe) Data processing unit (DPU) "ABOUT CXL". Compute
Compute_Express_Link
American semiconductor company
October 2023 the company was renamed to Zero ASIC, with a distinct focus on chiplet-based products and FPGA design tools. Adapteva was founded in March 2008
Zero_ASIC
2022 AMD 5-nanometer processor microarchitecture
Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023. AMD Provides More Ryzen 9 7950X3D
Zen_4
Electronic communication subsystem on an integrated circuit
the performance of NoC is use wireless communication channels between chiplets — named wireless network on chip (WiNoC). In a multi-core system, connected
Network_on_a_chip
Electronic component
can be stacked vertically or tiled horizontally, with techniques like chiplets or quilt packaging. SiPs connect the dies with standard off-chip wire bonds
System_in_a_package
Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023. AMD Provides More Ryzen 9 7950X3D
List_of_AMD_Ryzen_processors
Number of transistors in a device
transistors 6,813 without depletion mode pull-up transistors 3,900,000,000 core chiplet die, 2,090,000,000 I/O die Estimate Versal Premium are confirmed to be
Transistor_count
64-bit extension of the ARM architecture
MPAM domains to better support shared-memory computer systems on multi-chiplet and multi-chip systems Hypervisor memory control for trace and statistical
AArch64
Chinese fabless semiconductor manufacturing company, fully owned by Huawei
HiSilicon's second generation server processor launched in 2016. It is the first chiplet-based Kunpeng with two computing dies. It features: 32x ARM Cortex-A57
HiSilicon
Netherlands-based chip company
for Europe) project to support the development of a high‑performance AI chiplet. By mid‑2025, Axelera AI was estimated to have raised more than US$200
Axelera_AI
Core Series 1. Meteor Lake is the first Intel mobile generation to use a chiplet architecture, which means that the processor is a multi-chip module. In
List_of_Intel_processors
American multinational technology company
company's main competitor, AMD, introduced the Zen microarchitecture and a new chiplet-based design to critical acclaim. Since its introduction, AMD, once unable
Intel
Gaming Graphics Cards, Built on Groundbreaking AMD RDNA 3 Architecture with Chiplet Design". AMD (Press release). April 21, 2023. "AMD Radeon RX 9060 Specs"
List of AMD graphics processing units
List_of_AMD_graphics_processing_units
Chinese semiconductor chip manufacturer
launches with eight cores, 3.7GHz clocks, PCIe 4.0, DDR5 memory support, and chiplet-based design". Tom's Hardware. Retrieved 2024-02-27. "兆芯新一代开先® KX-7000系列自主高性能桌面处理器正式发布
Zhaoxin
AMD compute-focused GPU microarchitecture
The third iteration of CDNA switches to a MCM design utilizing different chiplets manufactured on multiple nodes. Currently consisting of the MI300X and
CDNA_(microarchitecture)
Layer between an integrated circuit and a printed circuit board
their second-generation 3D-NoC technology, which combines small dies ("chiplets"), fabricated at the FDSOI 28 nm node, on a 65 nm CMOS interposer. Another
Interposer
Chinese-born American businesswoman
and manufacture of chiplet packaging. The venture-backed company opened a $2 billion facility in Tampines in 2023 to produce chiplets for their customers
Weili_Dai
Open-source CPU instruction set architecture
December 2021). "Ventana Develops RISC-V Chiplet". Microprocessor Report. Dahad, Nitin (6 September 2021). "RISC-V Chiplet Startup Raises $38m, Targets Data
RISC-V
Semiconductor company
and defect analysis in logic and memory chip manufacturing, including chiplet production (see Advanced Packaging). The technologies used include, among
Carl_Zeiss_SMT
Micro-electronic component
options. Benchmarks, such as COSMIC, are developed to help such evaluations. Chiplet List of system on a chip suppliers Post-silicon validation Arm architecture
System_on_a_chip
Annual technology conference
manufacturability (DFM), hardware security, physical design, IP cores, chiplets, and embedded systems. In 2024 DAC received 1545 research paper submissions
Design_Automation_Conference
Semiconductor manufacturing process
and, therefore, interconnect capacitance; IC design innovations (2.5D chiplets, 3D interconnect), more advanced EDA tools. In September 2022, Samsung
2_nm_process
Semiconductor manufacturing processes
31 March 2023. Wickens, Katie (30 August 2022). "AMD's Lisa Su confirms chiplet-based RDNA 3 GPU architecture". PC Gamer. Retrieved 20 September 2022.
5_nm_process
1600–3300 (2100–3600 boost) 3200 MHz HT up to 4 links 16 MB (8 MB per chiplet) Socket G34 Quad-channel DDR3 Piledriver Trinity SempronX2 240, AthlonX2
Table_of_AMD_processors
6th generation Xeon x86 server processors designed by Intel, released in 2024
2024. Morgan, Timothy Prickett (September 22, 2023). "Intel Gets its Chiplets In Order With 6th Gen Xeon SPs". The Next Platform. Retrieved June 4, 2024
Granite_Rapids
Chinese microprocessor manufacturer
on sale in 2027, use a sub-10 nm process technology and would utilise chiplets with over 32 cores. Loongson was said to have stated that the company had
Loongson
Metal plating process
Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (1st ed. 2025 ed.). Singapore: Springer Nature
Electroless nickel immersion gold
Electroless_nickel_immersion_gold
Task of creating a processor
(GPUs), and neural processing units (NPUs) onto a single die or set of chiplets. The design process involves choosing an instruction set and a certain
Processor_design
American technology company
software includes: PathWave electronic design automation engineering software Chiplet interconnect design Engineering data management Software quality engineering
Keysight
Japanese technology corporation
(in Japanese). 2024-02-27. Retrieved 2024-03-08. "Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan". Tenstorrent. 2024-02-27
Rapidus
company specializes in next-generation, energy-efficient optical transceiver chiplets designed for telecom, AI data centers, and IoT infrastructure. In 2024
Economy_of_Egypt
Memory hierarchy concept applied to CPU caches with multiple levels
core, 8-way inclusive L3 cache – 16 MB local per 4-core CCX, 2 CCXs per chiplet, 16-way non-inclusive. Up to 64 MB on desktop CPUs and 256 MB on server
Cache_hierarchy
Indian-American computer scientist and business executive
Lives". Forbes. Clark, Don (2023-05-11). "U.S. Focuses on Invigorating 'Chiplets' to Stay Cutting-Edge in Tech". The New York Times. ISSN 0362-4331. Retrieved
Anirudh_Devgan
Semiconductor foundry company
GlobalFoundries facilities in Malta, NY. Going forward, AMD pursued a chiplet design with the Zen 2 series. Zen 2 desktop and server processors consist
GlobalFoundries
Shared IC wafer-fabrication service
materials than silicon like InP, flexible electronics, microfluidics and even chiplets. A refinement of MPW is multi-layer mask (MLM) arrangement, where a limited
Multi-project_wafer_service
San Francisco-based venture capital firm
the 2025 seed round. Ayar Labs: optical I/O data company that produces chiplets for the DoD. The Founders Fund (FF Science) led the seed round and participated
Founders_Fund
System of building very large integrated circuit networks
using the wafer only for interconnects between tightly-packed, small, bare chiplets. Si-IF-based processors and network switches have been studied. Many companies
Wafer-scale_integration
Brand of computer products
Gaming Graphics Cards, Built on Groundbreaking AMD RDNA 3 Architecture with Chiplet Design". AMD. "AMD Unveils Next-Generation AMD RDNA™ 4 Architecture with
Radeon
PC chip handling onboard control tasks
on 2016-06-05. Retrieved 2015-05-07. "AMD at ISSCC 2015: Carrizo and Excavator Details". "Chiplets Are the Future, but They Won't Replace Moore's Law".
Northbridge_(computing)
advanced integrated circuit packaging technology that bonds dies and/or chiplets onto an interposer for enclosure within a single package 3D integration
Glossary of microelectronics manufacturing terms
Glossary_of_microelectronics_manufacturing_terms
Series of integrated graphics processors
December 2022. "Intel Meteor Lake Client Processors to use Arc Graphics Chiplets". Archived from the original on February 17, 2022. "[Intel-gfx] [PATCH
Intel_Graphics_Technology
interconnection with sub-micron alignment accuracy. Small high yielding "chiplets" made from any semiconductor material (silicon, gallium arsenide, silicon
Quilt_packaging
Retrieved 2024-10-04. "Intels neuer Anlauf mit "Sunny Cove", Gen-11-GPU und Chiplets". heise online (in German). 12 December 2018. Retrieved 2018-12-12. "Intel
List of Intel CPU microarchitectures
List_of_Intel_CPU_microarchitectures
Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023. AMD Provides More Ryzen 9 7950X3D
List of AMD processors with 3D graphics
List_of_AMD_processors_with_3D_graphics
Intel GPU architecture
Cutress, Ian (November 17, 2019). "Intel's Xe for HPC: Ponte Vecchio with Chiplets, EMIB, and Foveros on 7nm, Coming 2021". AnandTech. Archived from the original
Intel_Xe
2017 AMD 14-nanometer processor microarchitecture
Branding and Model Cores (threads) Clock rate (GHz) L3 cache (total) TDP Chiplets Core config Release date Launch price Base PBO 1–4 (≥5) XFR 1–2 Ryzen Threadripper
Zen_(first_generation)
Brand of AMD graphics cards intended for professional use
Model (Code name) Release date & price Architecture & fab Chiplets (active) Transistors & die size Core Fillrate Processing power (TFLOPS) Infinity Cache
Radeon_Pro
Family of Intel's single-chip chipsets
High-End".{{cite web}}: CS1 maint: deprecated archival service (link) "Chiplets Are the Future, but They Won't Replace Moore's Law". "4th Gen AMD EPYC
Platform_Controller_Hub
System composed of non-physical objects, i.e. ideas or concepts
cooperating institutions in an upward spiral. See Best practice In technology, Chiplets are tiny hardware subsystem implementations of SoCs (systems on a chip)
Conceptual_system
2018 AMD 12-nanometre processor microarchitecture
Branding and Model Cores (threads) Clock rate (GHz) L3 cache (total) TDP Chiplets Core config Release date Launch price Base PB2 Ryzen Threadripper 2990WX
Zen+
Timeline of microprocessors
180 nm to 45 nm. A new trend appears, the multi-chip module made of several chiplets. This is multiple monolithic chips in a single package. This allows higher
Microprocessor_chronology
Branding and model Cores (threads) Clock (GHz) L3 cache (total) Chiplets Core config TDP Release date Base Boost Ryzen 9 7945HX3D 16 (32) 2.3 5.4 128 MB
List_of_AMD_mobile_processors
Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (1st ed. 2025 ed.). Singapore: Springer Nature
Electrochemical_migration
One of the two chips in the core logic chipset architecture on a PC motherboard
High-End".{{cite web}}: CS1 maint: deprecated archival service (link) "Chiplets Are the Future, but They Won't Replace Moore's Law". "AMD Documentation
Southbridge_(computing)
Multiple electronic componets in a single package
substrate, and therefore be part of a hybrid module, multi-chip module or chiplet module/implementation. The substrate for IPDs can be rigid like ceramic
Integrated_passive_devices
Layer used to relocate a microchip's contacts
Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (1st ed. 2025 ed.). Singapore: Springer Nature
Redistribution_layer
Physical implementation of an artificial neural network with optical components
network models into sub-models that can be distributed across multiple chiplets in parallel. Taichi achieved 91.89% accuracy in tests with the Omniglot
Optical_neural_network
Array of processing elements specialized for parallelizable workloads
Keckler, Stephen W. (2021). "Simba: Scaling deep-learning inference with chiplet-based architecture". Communications of the ACM. 64 (6). New York, NY, USA:
Spatial_architecture
Technology used to deposit metal beams onto integrated circuits for connecting them
individual devices and leaving them with self-supporting beam leads or internal chiplets cantilevered beyond the semiconductor material. These contacts not only
Beam_lead_technology
Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (1st ed. 2025 ed.). Singapore: Springer Nature
Wafer_bond_characterization
CHIPLET
CHIPLET
CHIPLET
CHIPLET
Girl/Female
Hindu
Female
English
English name derived from the vocabulary word, Sunday, from Old English Sunnandæg, literally SUNDAY means "day of the sun."Â
Boy/Male
American, Australian, British, Chinese, Danish, English, German, Hebrew, Swedish
Born of the Right Hand; Abbreviation of Benjamin and Benedict; Son
Boy/Male
Indian, Punjabi, Sikh
Brave and Knowledgeable
Boy/Male
Hindu
Morning, Dawn
Boy/Male
Indian, Sanskrit
The Hare Marked Moon
Boy/Male
Tamil
Cheliyan | சேலியாà®
Rich, Resourceful, Prosperous
Girl/Female
Assamese, Hindu, Indian, Kannada, Malayalam, Marathi, Punjabi, Sanskrit, Sikh, Tamil, Telugu
Full of Joy
Boy/Male
German, Latin
Conqueror
Girl/Female
Assamese, Celebrity, Gujarati, Hindu, Indian, Jain, Kannada, Malayalam, Marathi, Oriya, Sanskrit, Sindhi, Tamil, Telugu
Long Practice; Study; Fulfilment; Achievement; Goddess Durga
CHIPLET
CHIPLET
CHIPLET
CHIPLET
CHIPLET