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Enclosure for an electronic device
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems
Electronic_packaging
Enclosure or protection of products for distribution, storage, and sale
packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains
Packaging
Electronic component
Johnson, Mark Strickland and David Gerke, NASA Electronic Parts and Packaging Program. “3-D Packaging: A Technology Review.” June 23, 2005. Retrieved
System_in_a_package
Final stage of semiconductor device fabrication
practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early
Integrated_circuit_packaging
Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards
List of electronic component packaging types
List_of_electronic_component_packaging_types
Trade association for electronics
for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. In 1999, the
IPC_(electronics)
Discrete device in an electronic system
electronic circuit with a particular function (for example an amplifier, radio receiver, or oscillator). Basic electronic components may be packaged discretely
Electronic_component
electronic packaging, primarily consisting of epoxy resin, phenolic compounds, curing agent, fillers, and various additives. To safeguard electronic components
Epoxy_molding_compounds
Topics referred to by the same term
Chip package or chip carrier Electronic packaging, in electrical engineering Automotive package, in automobile production and marketing Package holiday
Package
Mechanical design approach
major successes with physics of failure at the die-level, the component packaging community had four major successes arise from their work in the 1970s
Physics_of_failure
Method of circuit board manufacture
of integrated circuit leads. COB effectively merges two levels of electronic packaging: level 1 (components) and level 2 (wiring boards), and may be referred
Chip_on_board
Power semiconductor through-hole package
The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation
TO-220
Integrated circuit packaging method
Package on a package, or package on package (PoP), is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for
Package_on_a_package
Aims to overcome limitations of semiconductors
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging, where a single die is packaged. Advanced
Advanced packaging (semiconductors)
Advanced_packaging_(semiconductors)
Board to support and connect electronic components
delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required to dry
Printed_circuit_board
American electronics engineer
electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and
Beth_Keser
American video game company
in square packages modeled after album covers (such as those for 1983's M.U.L.E. and Pinball Construction Set). Hawkins thought the packaging would both
Electronic_Arts
Cabinet for electrical or electronic equipment
in hazardous areas, such as petrochemical plants or coal mines. Electronic packaging may place many demands on an enclosure for heat dissipation, radio
Electrical_enclosure
Aspect of hardware design
stick Computer hardware Electronic packaging Packaging engineering List of computer size categories List of integrated circuit package dimensions "Form factor"
Form_factor_(design)
Array of antennas creating a steerable beam
number of simultaneous beams is limited by practical reasons of electronic packaging of the beam formers to approximately three simultaneous beams for
Phased_array
American academic
thermal performance of a tape ball grid array (TBGA) package". Journal of Electronic Packaging. 122 (2): 107–114. doi:10.1115/1.483141. Tyan-Min Niu;
Bahgat_G._Sammakia
Device that vaporizes a liquid nicotine solution for inhalation
An electronic cigarette (e-cigarette) or vape is a device that simulates tobacco smoking. It consists of an atomizer, a power source such as a battery
Electronic_cigarette
Academic journal
specific materials science involves transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications
Journal of Electronic Materials
Journal_of_Electronic_Materials
Type of electronic component package
package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may
Dual_in-line_package
Transparent non-crystalline solid material
Electronic Packaging and Integration: High Q Inductances for 2.35 GHZ Impedance Matching in 0.05 mm Thin Glass Substrates". 2018 IEEE 68th Electronic
Glass
Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes "nodule" structures that extend
Quilt_packaging
American application engineer (1941–2026)
of electronic packaging. In 2008, he was named a fellow of the Institute of Electrical and Electronics Engineers, "for contributions to electronic packaging
Daniel_Amey
Document included in a package of medicine
(2015). "The Package Insert". US Pharm. 40 (5): 8–10. Nadine Vanlaer (August 31, 2006). "Drug Package Inserts: the Letter of the Law - Packaging Gateway"
Medication_package_insert
Annual award for contributions to electronic component manufacturing
The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award
IEEE Rao R. Tummala Electronics Packaging Award
IEEE_Rao_R._Tummala_Electronics_Packaging_Award
Computer of the Saturn V rocket
Owego, NY. "Mechanical and Electronic Packaging for a Launch-Vehicle Guidance Computer." International Electronic Circuit Packaging Symposium 21–24 August
Launch Vehicle Digital Computer
Launch_Vehicle_Digital_Computer
Electronic circuit formed on a small, flat piece of semiconductor material
techniques are collectively known as advanced packaging. Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as multi-chip
Integrated_circuit
Process of duplicating all data on a digital storage drive
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME). pp. 393–396. doi:10.1109/SIITME.2015.7342360. ISBN 978-1-5090-0332-7
Disk_cloning
Type of packaging
The terms active packaging, intelligent packaging, and smart packaging refer to amplified packaging systems used with foods, pharmaceuticals, and several
Active_packaging
Packaging designed to resist child access
Child-resistant packaging or CR packaging is special packaging used to reduce the risk of children ingesting hazardous materials. This is often accomplished
Child-resistant_packaging
Packaging technology
hermeticity testing. S.-H. Choa (2005). "Reliability of MEMS packaging: vacuum maintenance and packaging induced stress". Microsyst. Technol. 11 (11): 1187–1196
Wafer_bonding
Materials' resistance to heat transfer
of Electronic Packaging. Springer Science & Business Media. ISBN 978-1-4419-7759-5. Guoping Xu (2006), Thermal Management for Electronic Packaging, Sun
Thermal conductance and resistance
Thermal_conductance_and_resistance
Topics referred to by the same term
Look up packaging in Wiktionary, the free dictionary. Packaging is the science, art and technology of enclosing or protecting products for distribution
Packaging_(disambiguation)
Topics referred to by the same term
operated by Google Registry Zip tone, in telephony Zig-zag in-line package, electronic packaging Zip fuel, a type of jet fuel Zip tie, a cable fastener Zrt-
Zip
Packing material
Cushioning List of generic and genericized trademarks Packaging "Bubble Film and Bags". Packaging Knowledge. Retrieved September 28, 2010. Petch, Michael
Bubble_wrap
Enclosure for a mechanism, electronic circuit, etc.
case Gear housing Junction box, a housing for electrical components Electronic packaging Vangelder (24 February 2017). "Basic Components of the Rotary Engine"
Housing_(engineering)
siliconfareast.com. "AMETEK Electronic Components and Packaging, a world leading producer of end to end electronic packaging solutions for harsh environments
Ball_bonding
Branch of physics and electrical engineering
electronic circuit with a particular function. Components may be packaged singly or in more complex groups as integrated circuits. Passive electronic
Electronics
Legally mandated packaging of tobacco products without any brand imagery
Plain tobacco packaging, also known as generic, neutral, standardised or homogeneous packaging, is packaging of tobacco products, typically cigarettes
Plain_tobacco_packaging
A Packaging Recovery Note (PRN) is a type of document that provides evidence waste packaging material has been recycled into a new product. They form a
Packaging_Recovery_Note
Circuit board manufacturing technique
Board-to-board connector Surface-mount technology Via (electronics) Electronic Packaging: Solder Mounting Technologies in K. H. Buschow et al (eds.), Encyclopedia
Through-hole_technology
Class of digital circuits
products through relocating the power supply pins to the package corners, together with packaging, cost reduction, and manufacturing scale. The Texas Instruments
Transistor–transistor_logic
Study of heat conduction between solid bodies
fields where contact conductance is of importance are: Electronics Electronic packaging Heat sinks Brackets Industry Nuclear reactor cooling Gas turbine
Thermal_contact_conductance
Integrated circuit packaging technology
standard wafer-level packaging (WLP) solutions. Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers
Fan-out_wafer-level_packaging
EPERN Electronic Packaging Waste Export Recovery Notes EPOW European Pathway to Zero Waste EPR Environmental Permitting Regulations EPRN Electronic Packaging
List of waste management acronyms
List_of_waste_management_acronyms
Multinational materials technology company
components from platinum and materials for hermetic sealing and electronic packaging) Zinc Chemicals (zinc oxides and powders used for corrosion or ultraviolet
Umicore
Opening in the surface of an object
a lens. Pinholes on produce packaging have been used to control the atmosphere and relative humidity within the packaging. In many fields, pinholes are
Hole
Enclosure and protection of food
Food packaging is a packaging system specifically designed for food and represents one of the most important aspects among the processes involved in the
Food_packaging
Method for producing electronic circuits
Electronics manufacturing services List of electronics package dimensions List of electronic component packaging types Plastic leaded chip carrier Point-to-point
Surface-mount_technology
American electrical engineer (1953–2026)
contributed to over 200 patents and authored many papers in the field of electronic packaging. Google Scholar lists over 400 entries with his name. Upon retiring
Paul_William_Coteus
Means of packaging an integrated circuit
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before
Wafer-level_packaging
advanced IC packaging, where it enables the processing of glass wafers and panels with through-glass vias (TGVs) for semiconductor packaging and MEMS devices
Laser_Induced_Deep_Etching
(real or simulated electronic test equipment) capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on wafer
Automatic_test_equipment
Multiple electronic componets in a single package
packages (like DIL, DIP, QFN, chip-scale package/CSP, wafer level package/WLP etc.) used in electronic packaging. Integrated passives can also act as a
Integrated_passive_devices
Overview of and topical guide to electronics
Sensors Surface acoustic wave (SAW) Electronic packaging Electronic circuit simulation Electronic design automation Electronic noise Mathematical methods in
Outline_of_electronics
Removing the protective cover of an integrated circuit
Energy Irradiation Facilities in Europe" (PDF). nepp.nasa.gov. "Electronic Packaging and Space Parts News, EEE Links Vol. 5 No. 2, October 1999" (PDF)
Decapping
Failed NASA impactor mission to Mars (1999)
D'Agostino, S. (March 1999). "New Millennium DS2 electronic packaging an advanced electronic packaging "sandbox"". 1999 IEEE Aerospace Conference. Proceedings
Deep_Space_2
Shoplifting prevention mechanism
the preservation of the retail packaging aesthetics by easing the application of security tags within product packaging. Source tagging allows the EAS
Electronic article surveillance
Electronic_article_surveillance
Type of business industry usually conducted over the internet
and reduced packaging material used by 19 percent by weight since 2016. Amazon is requiring retailers to manufacture their product packaging in a way that
E-commerce
Technology used to produce electronic components
elements". 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging. pp. 1–5. doi:10.1109/ICEPT.2011.6066957. ISBN 978-1-4577-1770-3
Thick-film_technology
Numerical solution method of computational electromagnetics
simulation for modeling interconnects for various applications in electronic packaging. FDFD has also been used for various scattering problems at optical
Finite-difference frequency-domain method
Finite-difference_frequency-domain_method
Taiwanese manufacturer of semiconductor testing products
The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D and 3D packaging, system
ASE_Group
Light-sensitive material used in making electronics
Films: Microcontact Printing" (PDF). Montrose, Mark I (1999). The Electronic Packaging Handbook. CRC Press. Novak, R.E (2000). Cleaning Technology in Semiconductor
Photoresist
Programmable machine that processes data
sequences of arithmetic or logical operations (computation). Modern digital electronic computers can perform generic sets of operations known as programs, which
Computer
Electronic device for deceiving detection systems
An electronic countermeasure (ECM) is an electrical or electronic device designed to trick or deceive radar, sonar, or other detection systems, like infrared
Electronic_countermeasure
Media. pp. 17–. ISBN 978-94-011-7012-3. Electronic Products. United Technical Publications. 1989. Electronic Packaging and Production. Cahners Pub. 1987. Carill
Photoplotter
Small roll of tobacco made to be smoked
same product is displayed in alternative packaging. Companies have manipulated a variety of elements on packaging designs to communicate the impression of
Cigarette
Video game
the actual wreckage on the packaging. Laden VS USA also bears the marks of "Made in China" and "Ages 5 and Up" on the packaging. Laden VS USA has received
Laden_VS_USA
Device or process that makes unauthorized access to the protected object easily detected
unlikely that they will have time to open the packaging, examine or remove the items, and restore the packaging to its original untampered condition. Tamper-evident
Tamper-evident_technology
Holder for a battery
Holder being designed for your design | Medical Design Magazine Electronic Packaging, Microelectronics and Interconnection Dictionary By Charle A. Harper
Battery_holder
Professional and Scholarly Excellence awards
traditional print, electronic publications and print/electronic packages; and Six awards for electronic products, including electronic platforms and e-products
PROSE_Awards
Canadian University Professor and Polish Engineer
Optimization", INTERPACK'07, The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, Vancouver, British Columbia
Adam_Skorek
Process of joining metal pieces with heated filler metal
solder". 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging. Vol. 61. pp. 1736–1739. doi:10.1109/ICEPT.2010
Soldering
Chemical compound
It finds extensive use in electronic applications including printed circuit boards and general packaging for electronic materials. The toxicity has
Tetrabromobisphenol A diglycidyl ether
Tetrabromobisphenol_A_diglycidyl_ether
(IEEE) in 2012 for his contributions to reliability prediction for electronic packaging. "2012 elevated fellow" (PDF). IEEE Fellows Directory. Archived from
Pradeep_Lall
24% more than 2012. CIPS focuses on the following main aspects: electronic packaging technologies hybrid systems and high Power density integration reliability
International Conference on Integrated Power Electronics Systems
International_Conference_on_Integrated_Power_Electronics_Systems
Chinese professor of electronic engineering
to the development of advanced thermally conductive materials for electronic packaging and thermal management applications. Thermal Interface Materials
Xu_Jianbin
German engineer
Electronics Packaging Society (EPS). Aschenbrenner has written or contributed to more than 100 journal and proceedings articles on electronic packaging, and
Rolf_Alfons_Aschenbrenner
Electrical connection
greater connectivity. An alternate type of 3D package can be found in IBM's Silicon Carrier Packaging Technology, where ICs are not stacked but a carrier
Through-silicon_via
Bangladeshi academic and 1st Vice-Chancellor of the Dhaka Central University
semiconducting oxide–based nanostructures, gas sensing technologies, electronic packaging materials, and the degradation of materials in harsh environments
A_S_M_Abdul_Haseeb
American manufacturer
Hybricon is a supplier of electronic packaging for the aerospace, defense, and commercial markets, providing electronic subsystem integration. In 2011
Curtiss-Wright
Discarded electronic devices (E-Waste)
Electronic waste (E-Waste) describes discarded electrical or electronic devices. It is also commonly known as waste electrical and electronic equipment
Electronic_waste
An electronic lab notebook (also known as electronic laboratory notebook, or ELN) is a computer program designed to replace paper laboratory notebooks
List of electronic laboratory notebook software packages
List_of_electronic_laboratory_notebook_software_packages
Pictogram used to represent various electrical and electronic devices or functions
An electronic symbol is a pictogram used to represent various electrical and electronic devices or functions, such as wires, batteries, resistors, and
Electronic_symbol
(2014-02-18). "Intermittent Failures in Hardware and Software". Journal of Electronic Packaging. 136 (1): 011014. doi:10.1115/1.4026639. ISSN 1043-7398. Qi, H.;
Intermittent_fault
Electrical circuit with active components
An electronic circuit is composed of individual electronic components, such as resistors, transistors, capacitors, inductors and diodes, connected by
Electronic_circuit
American actor and comedian (born 1974)
thermal and thermomechanical phenomena in electronic packages". IEEE Transactions on Components and Packaging Technologies. 22 (4): 481–483. doi:10.1109/TCAPT
Eugene_Mirman
degradation Channel degradation Surface-state effects Package molding contamination—impurities in packaging compounds cause electrical failure Electromigration
Reliability_(semiconductor)
Topics referred to by the same term
a light bulb, LED, fuse (electrical), vacuum tube, glass case in electronic packaging, etc. (and at the top of a lighthouse, a lantern, the Popemobile
Glass_enclosure
Programmable scientific calculator produced by Hewlett-Packard
Howard W. (March 1982). "A look inside Hewlett-Packard's HP-11C". Electronic Packaging and Production Magazine. Archived from the original on 2017-09-17
HP-15C
Interconnect between layers in HDI substrates and PCBs
Fatigue Analysis of High Density Interconnect Vias,” Advances in Electronic Packaging, Vol. 10, No. 1, 1995 F. Liu, J. Lu, V. Sundaram, D. Sutter, G. White
Microvia
Software for electromagnetic simulation
multilayered electronic packaging structures U.S. Patent 5,566,083 Method for analyzing voltage fluctuations in multilayered electronic packaging structures
SPEED2000
Centerpiece of the car's sound and information system
the center of the dashboard or console, and provide an integrated electronic package. The head unit provides a user interface for the vehicle's information
Automotive_head_unit
Casing for integrated circuit or semiconductor components
High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging. Journal of the Microelectronics and Packaging Society. 21. 53-57. 10.6117/kmeps.2014.21.2.053
Semiconductor_package
Gateway that routes packets from a wireless LAN to another network
converged device saves desk space and simplifies wiring by replacing two electronic packages with one. It has a wired connection to the ISP, at least one jack
Wireless_gateway
Wafer bond with glass central layer
predictions of the devices. Glass solders are frequently used in electronic packaging. CERDIP packagings are an example. Outgassing of water from the glass solder
Glass_frit_bonding
ELECTRONIC PACKAGING
ELECTRONIC PACKAGING
Boy/Male
Arabic
Electric Light
Boy/Male
English American
A sometimes used as an independent name. Also, in England, 'Ernie' refers to the Electronic...
Female
English
English name derived from the vocabulary word, from Greek kyanos, CYAN means "dark blue" and "lapis lazuli." The color cyan is also sometimes called blue-green, electric blue, and turquoise.Â
ELECTRONIC PACKAGING
ELECTRONIC PACKAGING
Boy/Male
Hindu
Another name of Lord Shiva
Girl/Female
Tamil
New
Girl/Female
English
Blend of Deanne (divine) plus variants of Andrea (masculine) and Sandra (protector of man. ).
Girl/Female
Hebrew Ukrainian
Grace.
Male
Polish
Polish form of Roman Latin Valerianus, WALERIAN means "to be healthy, to be strong."Â
Girl/Female
Indian, Punjabi, Sikh
Desire; Wish
Boy/Male
Sikh
Lord of traditions
Girl/Female
Hindu, Indian, Marathi
Born to be Rich
Boy/Male
Gujarati, Hindu, Indian, Kannada, Malayalam, Marathi, Modern, Sanskrit
Prayer; Saints Saying; Verse Sound Praise; God's Prey; Mantras in Vedas
Boy/Male
Tamil
Expert, Brave
ELECTRONIC PACKAGING
ELECTRONIC PACKAGING
ELECTRONIC PACKAGING
ELECTRONIC PACKAGING
ELECTRONIC PACKAGING
n.
Amber; also, the alloy of gold and silver, called electrum.
n.
A dynamo-electric machine.
n.
The art or science of constructing or using the electric telegraph; the transmission of messages by means of the electric telegraph.
a.
Of or pertaining to electrogenesis; as, an electrogenic condition.
n.
A spectro-electric tube in which the decomposition of a liquid by the passage of an electric spark is observed.
a.
Relating to electrotonus; as, the electrotonic condition of a nerve.
n.
The electric catfish.
a.
Pertaining to the movements or force of electric or galvanic currents; dependent on electric force.
n.
Electric potential or potential difference, expressed in volts.
a.
Not electric; conducting electricity.
a.
Of or pertaining to electrical tension; -- said of a supposed peculiar condition of a conducting circuit during its exposure to the action of another conducting circuit traversed by a uniform electric current when both circuits remain stationary.
v. i.
To become electric.
n.
A genus of African siluroid fishes, including the electric catfishes. See Electric cat, under Electric.
a.
Alt. of Electrical
a.
Pertaining to electricity; consisting of, containing, derived from, or produced by, electricity; as, electric power or virtue; an electric jar; electric effects; an electric spark.
n.
A nonconductor of electricity, as amber, glass, resin, etc., employed to excite or accumulate electricity.
a.
Electrotonic.
n.
An instrument for the exact measurement of electric currents.
a.
Acting by the operation of both light and electricity; -- said of apparatus for producing pictures by electric light.
n.
The torpedo, or electric ray, the touch of which gives an electric shock. See Electric fish, and Torpedo.