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Enclosure for an electronic device
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems
Electronic_packaging
Enclosure or protection of products
packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains
Packaging
Integrated circuit packaging method
Johnson, Mark Strickland and David Gerke, NASA Electronic Parts and Packaging Program. “3-D Packaging: A Technology Review.” June 23, 2005. Retrieved
System_in_a_package
Final stage of semiconductor device fabrication
corrosion. The case, known as a "package", supports the electrical contacts that connect the device to a circuit board. The packaging stage is followed by testing
Integrated_circuit_packaging
Engineer and academic
Conference on Electronic Packaging Technology 2025 – Lifetime Achievement Award Recipient, International Microelectronics Assembly and Packaging Society (IMAPS)
John_H._Lau
Discrete device in an electronic system
electronic circuit with a particular function (for example an amplifier, radio receiver, or oscillator). Basic electronic components may be packaged discretely
Electronic_component
Topics referred to by the same term
Chip package or chip carrier Electronic packaging, in electrical engineering Automotive package, in automobile production and marketing Package holiday
Package
Method of circuit board manufacture
of integrated circuit leads. COB effectively merges two levels of electronic packaging: level 1 (components) and level 2 (wiring boards), and may be referred
Chip_on_board
Annual award for contributions to electronic component manufacturing
R. Tummala Electronics Packaging Award, formerly called the IEEE Electronics Packaging Award and the IEEE Components, Packaging, and Manufacturing Technologies
IEEE Rao R. Tummala Electronics Packaging Award
IEEE_Rao_R._Tummala_Electronics_Packaging_Award
Mechanical design approach
major successes with physics of failure at the die-level, the component packaging community had four major successes arise from their work in the 1970s
Physics_of_failure
Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards
List of electronic component packaging types
List_of_electronic_component_packaging_types
Cabinet for electrical or electronic equipment
in hazardous areas, such as petrochemical plants or coal mines. Electronic packaging may place many demands on an enclosure for heat dissipation, radio
Electrical_enclosure
Aims to overcome limitations of semiconductors
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging, where a single die is packaged. Advanced
Advanced_packaging
Trade association for electronics
for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. In 1999, the
IPC_(electronics)
American electronics engineer
electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and
Beth_Keser
Any machine used for packaging
Packaging machinery is used throughout all packaging operations, involving primary packages to distribution packs. This includes many packaging processes:
Packaging_machinery
Power semiconductor through-hole package
The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation
TO-220
Packing material
Cushioning List of generic and genericized trademarks Packaging "Bubble Film and Bags". Packaging Knowledge. Retrieved September 28, 2010. Petch, Michael
Bubble_wrap
Packaging designed to resist child access
Child-resistant packaging or CR packaging is special packaging used to reduce the risk of children ingesting hazardous materials. This is often accomplished
Child-resistant_packaging
Packaging that interacts with products or their environment
Active packaging refers to packaging systems designed to perform functions beyond passive containment and physical protection. Active materials deliberately
Active_packaging
American video game company
in square packages modeled after album covers (such as those for 1983's M.U.L.E. and Pinball Construction Set). Hawkins thought the packaging would both
Electronic_Arts
Legally mandated packaging of tobacco products without any brand imagery
Plain tobacco packaging, also known as generic, neutral, standardised or homogeneous packaging, is packaging of tobacco products, typically cigarettes
Plain_tobacco_packaging
Topics referred to by the same term
operated by Google Registry Zip tone, in telephony Zig-zag in-line package, electronic packaging Zip fuel, a type of jet fuel Zip tie, a cable fastener Zrt-
Zip
Academic journal
specific materials science involves transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications
Journal of Electronic Materials
Journal_of_Electronic_Materials
American mechanical engineer (born 1952)
American mechanical engineer known for his works in the reliability of electronic packaging including the physics-of-failure approach. He leads the Center for
Michael_G._Pecht
Case or other packaging used to protect optical discs
Optical disc packaging is the packaging that accompanies compact discs, DVDs, and other formats of optical discs. Most packaging is rigid or semi-rigid
Optical_disc_packaging
Type of electronic component package
package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may
Dual_in-line_package
Enclosure and protection of food
Food packaging is a packaging system specifically designed for food. It is one of the processes that make up the food system, having the role of providing
Food_packaging
Topics referred to by the same term
Look up packaging in Wiktionary, the free dictionary. Packaging is the science, art and technology of enclosing or protecting products for distribution
Packaging_(disambiguation)
Device that vaporizes a liquid nicotine solution for inhalation
An electronic cigarette (e-cigarette) or vape is a device that simulates tobacco smoking. It consists of an atomizer, a power source such as a battery
Electronic_cigarette
Array of antennas creating a steerable beam
number of simultaneous beams is limited by practical reasons of electronic packaging of the beam formers to approximately three simultaneous beams for
Phased_array
Type of delivery service
major carriers have a packaging engineering staff that provides packaging guidelines and sometimes package design and package testing services. Many
Package_delivery
Packaging that results in improved sustainability
Sustainable packaging refers to the design, manufacture and use of packaging with the aim of reducing environmental impacts over its life cycle while maintaining
Sustainable_packaging
Integrated circuit packaging method
Package on a package, or package on package (PoP), is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for
Package_on_a_package
Device or process that makes unauthorized access to the protected object easily detected
unlikely that they will have time to open the packaging, examine or remove the items, and restore the packaging to its original untampered condition. Tamper-evident
Tamper-evident_technology
Packaging technology
hermeticity testing. S.-H. Choa (2005). "Reliability of MEMS packaging: vacuum maintenance and packaging induced stress". Microsyst. Technol. 11 (11): 1187–1196
Wafer_bonding
Board to support and connect electronic components
delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required to dry
Printed_circuit_board
Sterile food processing technique
and packaging system must be cleaned and re-sterilized before processing and/or packaging operations can resume. Packaging equipment and packaging materials
Aseptic_processing
Type of retail packaging
mono-material fractions before recycling. Food packaging Plastic recycling Packaging waste Modified atmosphere packaging Food preservation Mulakkal, M.C.; Ekins
Multilayered_packaging
Branch of physics and electrical engineering
electronic circuit with a particular function. Components may be packaged singly or in more complex groups as integrated circuits. Passive electronic
Electronics
Electronic circuit formed on a small, flat piece of semiconductor material
techniques are collectively known as advanced packaging. Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as multi-chip
Integrated_circuit
American academic
thermal performance of a tape ball grid array (TBGA) package". Journal of Electronic Packaging. 122 (2): 107–114. doi:10.1115/1.483141. Tyan-Min Niu;
Bahgat_G._Sammakia
Aspect of hardware design
stick Computer hardware Electronic packaging Packaging engineering List of computer size categories List of integrated circuit package dimensions "Form factor"
Form_factor_(design)
(IEEE) in 2012 for his contributions to reliability prediction for electronic packaging. "2012 elevated fellow" (PDF). IEEE Fellows Directory. Archived from
Pradeep_Lall
Type of packaging
parts of the world, blister packs are the main packaging type since pharmacy dispensing and re-packaging are not common. A series of blister cavities is
Blister_pack
Regulation of the temperature of electronic circuitry to prevent inefficiency or failure
Retrieved 2010-06-29. 4 MATERIALS ISSUES - Materials for High-Density Electronic Packaging and Interconnection - The National Academies Press. 1990. doi:10
Thermal management (electronics)
Thermal_management_(electronics)
Polish-Canadian engineer and professor (born 1956)
Optimization", INTERPACK'07, The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, Vancouver, British Columbia
Adam_Skorek
Computer of the Saturn V rocket
Owego, NY. "Mechanical and Electronic Packaging for a Launch-Vehicle Guidance Computer." International Electronic Circuit Packaging Symposium 21–24 August
Launch Vehicle Digital Computer
Launch_Vehicle_Digital_Computer
Process of duplicating all data on a digital storage drive
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME). pp. 393–396. doi:10.1109/SIITME.2015.7342360. ISBN 978-1-5090-0332-7
Disk_cloning
Transparent non-crystalline solid material
Electronic Packaging and Integration: High Q Inductances for 2.35 GHZ Impedance Matching in 0.05 mm Thin Glass Substrates". 2018 IEEE 68th Electronic
Glass
Enclosure for a mechanism, electronic circuit, etc.
case Gear housing Junction box, a housing for electrical components Electronic packaging Vangelder (24 February 2017). "Basic Components of the Rotary Engine"
Housing_(engineering)
American application engineer (1941–2026)
of electronic packaging. In 2008, he was named a fellow of the Institute of Electrical and Electronics Engineers, "for contributions to electronic packaging
Daniel_Amey
Packaging for pharmaceutical preparations
Drug packaging (or pharmaceutical packaging) is process of packing pharmaceutical preparations for distribution, and the physical packaging in which they
Drug_packaging
Materials' resistance to heat transfer
of Electronic Packaging. Springer Science & Business Media. ISBN 978-1-4419-7759-5. Guoping Xu (2006), Thermal Management for Electronic Packaging, Sun
Thermal conductance and resistance
Thermal_conductance_and_resistance
Method for producing electronic circuits
Electronics manufacturing services List of electronics package dimensions List of electronic component packaging types Plastic leaded chip carrier Point-to-point
Surface-mount_technology
(real or simulated electronic test equipment) capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on wafer
Automatic_test_equipment
American electrical engineer (1953–2026)
elected a Master Inventor. He authored many papers in the field of electronic packaging. Google Scholar lists over 400 entries with his name. Coteus was
Paul_William_Coteus
Class of digital circuits
doi:10.1147/rd.255.0603 Seraphim, D. P.; Feinberg, I. (1981), "Electronic Packaging Evolution in IBM", IBM Journal of Research and Development, 25 (5):
Transistor–transistor_logic
Airtight seal
using a secret seal. Some kinds of packaging must maintain a seal against the flow of gases, for example, packaging for some foods, pharmaceuticals, chemicals
Hermetic_seal
Software for electromagnetic simulation
multilayered electronic packaging structures U.S. Patent 5,566,083 Method for analyzing voltage fluctuations in multilayered electronic packaging structures
SPEED2000
Book published in digital form
An ebook (short for "electronic book"), also spelled as e-book or eBook, is a book publication made available in electronic form, consisting of text, images
Ebook
Security methodology
mechanism. Chicago Tylenol murders Child-resistant packaging FIPS 140-2 Ink tag Packaging and labelling Package pilferage Tamper-resistant switch Tamper-evident
Tamperproofing
and data management, and 3) interface technology (electrode and electronic packaging technologies). The Center has approximately 45 faculty that it works
Center for Biomimetic Microelectronic Systems
Center_for_Biomimetic_Microelectronic_Systems
Gateway that routes packets from a wireless LAN to another network
converged device saves desk space and simplifies wiring by replacing two electronic packages with one. It has a wired connection to the ISP, at least one jack
Wireless_gateway
Video game
the actual wreckage on the packaging. Laden VS USA also bears the marks of "Made in China" and "Ages 5 and Up" on the packaging. Laden VS USA has received
Laden_VS_USA
Topics referred to by the same term
a light bulb, LED, fuse (electrical), vacuum tube, glass case in electronic packaging, etc. (and at the top of a lighthouse, a lantern, the Popemobile
Glass_enclosure
Opening in the surface of an object
a lens. Pinholes on produce packaging have been used to control the atmosphere and relative humidity within the packaging. In many fields, pinholes are
Hole
Broad topic ranging from design conceptualization to product placement
Packaging engineering, also package engineering, packaging technology and packaging science, is a broad topic ranging from design conceptualization to
Packaging_engineering
Type of business industry usually conducted over the internet
and reduced packaging material used by 19 percent by weight since 2016. Amazon is requiring retailers to manufacture their product packaging in a way that
E-commerce
Circuit board manufacturing technique
Board-to-board connector Surface-mount technology Via (electronics) Electronic Packaging: Solder Mounting Technologies in K. H. Buschow et al (eds.), Encyclopedia
Through-hole_technology
Removing the protective cover of an integrated circuit
Energy Irradiation Facilities in Europe" (PDF). nepp.nasa.gov. "Electronic Packaging and Space Parts News, EEE Links Vol. 5 No. 2, October 1999" (PDF)
Decapping
Electrical circuit with active components
An electronic circuit is composed of individual electronic components, such as resistors, transistors, capacitors, inductors and diodes, connected by
Electronic_circuit
Programmable machine that processes data
sequences of arithmetic or logical operations (computation). Modern digital electronic computers can perform generic sets of operations known as programs, which
Computer
24% more than 2012. CIPS focuses on the following main aspects: electronic packaging technologies hybrid systems and high Power density integration reliability
International Conference on Integrated Power Electronics Systems
International_Conference_on_Integrated_Power_Electronics_Systems
Integrated circuit packaging technology
standard wafer-level packaging (WLP) solutions. Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers
Fan-out_wafer-level_packaging
Pictogram used to represent various electrical and electronic devices or functions
An electronic symbol is a pictogram used to represent various electrical and electronic devices or functions, such as wires, batteries, resistors, and
Electronic_symbol
Pallet-size shipping box
Glossary of Packaging Terms. Institute of Packaging Professionals. p. 33. ISBN 978-1-930268-27-2. "What is a Gaylord box?". Welch Packaging. Retrieved
Bulk_box
Discarded electronic devices
Electronic waste, also known as waste electrical and electronic equipment (WEEE), end-of-life (EOL) electronics, or simply e-waste, describes discarded
Electronic_waste
Document included in a package of medicine
(2015). "The Package Insert". US Pharm. 40 (5): 8–10. Nadine Vanlaer (August 31, 2006). "Drug Package Inserts: the Letter of the Law - Packaging Gateway"
Medication_package_insert
Swiss packaging and mechanical engineering company
of SIG's earlier packaging equipment efforts were focused on small dry food items such as chocolates and candy. The first packaging machines were delivered
SIG_Group
Multinational materials technology company
components from platinum and materials for hermetic sealing and electronic packaging) Zinc Chemicals (zinc oxides and powders used for corrosion or ultraviolet
Umicore
Professional and Scholarly Excellence awards
traditional print, electronic publications and print/electronic packages; and Six awards for electronic products, including electronic platforms and e-products
PROSE_Awards
Thin, flexible sheet of aluminium
2nd ed. Food Packaging, Principles and Practice, Boca Raton, FL, Taylor & Francis Group: ISBN 0-8493-3775-5. Chapter 7: Metal Packaging Materials. Degarmo
Aluminium_foil
American manufacturer
Hybricon is a supplier of electronic packaging for the aerospace, defense, and commercial markets, providing electronic subsystem integration. In 2011
Curtiss-Wright
Means of packaging an integrated circuit
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before
Wafer-level_packaging
Electrical connection
greater connectivity. An alternate type of 3D package can be found in IBM's Silicon Carrier Packaging Technology, where ICs are not stacked but a carrier
Through-silicon_via
Integrated circuit package with contacts on all 4 sides, on the underside of the package
controllers, and wireless LAN. Chip carrier Chip packaging and package types list Quad flat package Design requirements for outlines of solid state and
Flat_no-leads_package
Digital image analysis tool
for analyzing portable electronic products during drop impact tests". 2005 6th International Conference on Electronic Packaging Technology (PDF). pp. 121–126
Digital image correlation for electronics
Digital_image_correlation_for_electronics
Paper-like display technology
been used in smart packaging applications such as pharmaceutical reminders, interactive product labels and traceability tags. Electronic paper (e-paper)
Electronic_paper
Cylindrical shipping container used for shipping bulk cargo
Encyclopedia of Packaging Technology, Wiley (published 2010), pp. 375–381, ISBN 978-0-470-08704-6 ISO 16104 – 2003 Packaging – Transport packaging for dangerous
Drum_(container)
Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes "nodule" structures that extend
Quilt_packaging
Centerpiece of the car's sound and information system
the center of the dashboard or console, and provide an integrated electronic package. The head unit provides a user interface for the vehicle's information
Automotive_head_unit
Failed NASA impactor mission to Mars (1999)
D'Agostino, S. (March 1999). "New Millennium DS2 electronic packaging an advanced electronic packaging "sandbox"". 1999 IEEE Aerospace Conference. Proceedings
Deep_Space_2
Programmable scientific calculator produced by Hewlett-Packard
Howard W. (March 1982). "A look inside Hewlett-Packard's HP-11C". Electronic Packaging and Production Magazine. Archived from the original on 2017-09-17
HP-15C
Production line for filling bottles
portal Technology portal Beverage can Packaging and labeling Paine, F.A.; Paine, H.Y. (2012). A Handbook of Food Packaging. Springer US. p. 100. ISBN 978-1-4615-2810-4
Bottling_line
Multiple electronic componets in a single package
packages (like DIL, DIP, QFN, chip-scale package/CSP, wafer level package/WLP etc.) used in electronic packaging. Integrated passives can also act as a
Integrated_passive_devices
siliconfareast.com. "AMETEK Electronic Components and Packaging, a world leading producer of end to end electronic packaging solutions for harsh environments
Ball_bonding
advanced IC packaging, where it enables the processing of glass wafers and panels with through-glass vias (TGVs) for semiconductor packaging and MEMS devices
Laser_Induced_Deep_Etching
Post-use container and packing refuse
Packaging waste, the part of the waste that consists of packaging and packaging material, is a major part of the total global waste, and the major part
Packaging_waste
Electronic device for deceiving detection systems
An electronic countermeasure (ECM) is an electrical or electronic device designed to trick or deceive radar, sonar, or other detection systems, like infrared
Electronic_countermeasure
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